Laser Micro Material Processing
The invention concerns a process and apparatus which enable the highly efficient processing of any type of material with adaptive, feedback controlled pulses provided by a femtosecond laser.In order to do this, a femtosecond laser, which achieves material processing (removal) adjusted to a wide range of parameters by manipulating peripheral equipment, is utilised. The apparatus can be utilised, for instance, in the structuring of chips on a nanometric scale. Furthermore, it is predestined for applications in biotechnology and medicine. In this way, cells can be opened with precise incisions with a minimum of both energy input and damage.
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