Power and Electrical Engineering
This topic covers issues related to energy generation, conversion, transportation and consumption and how the industry is addressing the challenge of energy efficiency in general.
innovations-report provides in-depth and informative reports and articles on subjects ranging from wind energy, fuel cell technology, solar energy, geothermal energy, petroleum, gas, nuclear engineering, alternative energy and energy efficiency to fusion, hydrogen and superconductor technologies.
World’s first line scanner
… with monolithically integrated terahertz detectors for industrial applications. The Ferdinand-Braun-Institut has developed a terahertz (THz) line scanner for plastic components, enabling cost-effective realization of larger scan line lengths in…
Ion thermoelectric conversion devices for near room temperature
The electrode sheet of the thermoelectric device consists of ionic hydrogel, which is sandwiched between the electrodes to form, and the Prussian blue on the electrode undergoes a redox reaction…
Controlled laser drilling of microvias
In the production of printed circuit boards (PCBs), micrometer-diameter vias – known as microvias – are drilled through multilayer PCBs. Lasers can drill through these structures with high throughput and…
Transparent emissive microdisplays
… for ultra-light and compact augmented reality systems. As part of the HOT project (High-performance transparent and flexible microelectronics for photonic and optical applications), scientists from the Fraunhofer Institute for…
Inverters with constant full load capability
…enable an increase in the performance of electric drives. Overheating components significantly limit the performance of drivetrains in electric vehicles. Inverters in particular are subject to a high thermal load,…
Properties of new materials for microchips
… can now be measured well. Reseachers of Delft University of Technology demonstrated measuring performance properties of ultrathin silicon membranes. Making ever smaller and more powerful chips requires new ultrathin…
