Forum for Science, Industry and Business

Sponsored by:     3M 
Search our Site:

 

NDSU Develops Innovative Laser-Enabled Electronic Packaging Technology

25.10.2011
Small. Fast. Precise. A new electronics manufacturing technology developed at North Dakota State University, Fargo, eliminates challenges facing conventional packaging techniques and shows promise to significantly reduce the size and unit cost of microelectronic devices.

The technology, called Laser-Enabled Advanced Packaging (LEAP™), has the potential to enable high-volume handling, placement and interconnection of microelectronic components smaller than ever before possible.

LEAP™ is a comprehensive wafer-to-product electronic packaging technology for high-throughput, low-cost, contactless assembly of ultrathin semiconductor chips onto rigid and flexible substrates. The technology has been under development by the Advanced Electronics Packaging research group at the North Dakota State University Center for Nanoscale Science and Engineering (CNSE), Fargo, N. D., since 2008.

Recently the NDSU researchers successfully implemented the LEAP™ technology to fabricate the first-ever functional electronic device with a laser-assembled, ultra-thin silicon chip embedded in a flexible substrate. The research group is led by Dr. Val Marinov, associate professor of manufacturing engineering; and includes Dr. Orven Swenson, associate professor of physics at NDSU; Ross Miller, research engineer apprentice; and CNSE research staff, graduate students and undergraduate research assistants.

A key part of LEAP™ is the patent-pending process, Thermo-Mechanical Selective Laser Assisted Die Transfer (tmSLADT™). This process selectively and rapidly places ultra-thin (

“The LEAP™ technology and tmSLADT™ process are important because they potentially enable a new class of inexpensive electronic devices by the high-volume placement and interconnection of various types of ultra-thin, fine pitch, active and passive circuit components,” said Aaron Reinholz, associate director for electronics technology at NDSU CNSE. “These types of components are especially of interest for flex substrate electronics, as they allow devices to bend, roll and be manipulated into complex geometries.”

Reinholz said application of the LEAP™ technology offers a new paradigm for numerous types of flexible and potentially disposable microelectronic devices, such as garment-integrated RFID tags, intelligent sensors platforms, and self-adapting conformal antennas. He added that this technology has strong potential in the near future outside of defense applications to reduce the unit cost of high volume single-chip devices such as RFID tags, smart cards, chip-and-pin bank cards and “smart” bank notes. According to CNSE researchers, the tmSLADT™ process also has potential value in microelectromechanical systems (MEMS) fabrication or other micro-assembly applications.

The LEAP™ technology is outlined in “Laser-Enabled Advanced Packaging of Ultrathin Bare Dice in Flexible Substrates” which has been accepted for publication by IEEE Transactions on Components, Packaging and Manufacturing Technology, manuscript TCPMT-2011-105. Another manuscript, “Noncontact Selective Laser-Assisted Placement of Thinned Semiconductor Dice,” is currently under peer review.

This material is based on research sponsored by the Defense Microelectronics Activity (DMEA) under agreement number H94003-11-2-1102. This press release does not necessarily reflect the position or the policy of the Government and no official endorsement should be inferred.

For more information, contact aaron.reinholz@ndsu.edu

About NDSU CNSE
NDSU’s Center for Nanoscale Science and Engineering, Fargo, conducts multidisciplinary research with partners in government, industry, private and university sectors. CNSE’s scientific capabilities include flexible electronics and materials, electronics miniaturization, wireless sensors, RFID, bioactive materials, combinatorial science, and coatings technologies. www.ndsu.edu/cnse
About NDSU
North Dakota State University, Fargo, is notably listed among the nation’s top 108 public and private universities in the Carnegie Commission on Higher Education’s elite category of “Research Universities/Very High Research Activity.” As a student-focused, land grant, research institution with more than 14,000 students, NDSU is listed in the top 40 research universities in the U.S. without a medical school, based on research expenditures reported to the National Science Foundation. At the 55-acre NDSU Research & Technology Park, faculty, staff and students work with private sector researchers on leading-edge projects. www.ndsu.edu/research

Aaron Reinholz | Newswise Science News
Further information:
http://www.ndsu.edu/research

More articles from Power and Electrical Engineering:

nachricht Waste from paper and pulp industry supplies raw material for development of new redox flow batteries
12.10.2017 | Johannes Gutenberg-Universität Mainz

nachricht Low-cost battery from waste graphite
11.10.2017 | Empa - Eidgenössische Materialprüfungs- und Forschungsanstalt

All articles from Power and Electrical Engineering >>>

The most recent press releases about innovation >>>

Die letzten 5 Focus-News des innovations-reports im Überblick:

Im Focus: Neutron star merger directly observed for the first time

University of Maryland researchers contribute to historic detection of gravitational waves and light created by event

On August 17, 2017, at 12:41:04 UTC, scientists made the first direct observation of a merger between two neutron stars--the dense, collapsed cores that remain...

Im Focus: Breaking: the first light from two neutron stars merging

Seven new papers describe the first-ever detection of light from a gravitational wave source. The event, caused by two neutron stars colliding and merging together, was dubbed GW170817 because it sent ripples through space-time that reached Earth on 2017 August 17. Around the world, hundreds of excited astronomers mobilized quickly and were able to observe the event using numerous telescopes, providing a wealth of new data.

Previous detections of gravitational waves have all involved the merger of two black holes, a feat that won the 2017 Nobel Prize in Physics earlier this month....

Im Focus: Smart sensors for efficient processes

Material defects in end products can quickly result in failures in many areas of industry, and have a massive impact on the safe use of their products. This is why, in the field of quality assurance, intelligent, nondestructive sensor systems play a key role. They allow testing components and parts in a rapid and cost-efficient manner without destroying the actual product or changing its surface. Experts from the Fraunhofer IZFP in Saarbrücken will be presenting two exhibits at the Blechexpo in Stuttgart from 7–10 November 2017 that allow fast, reliable, and automated characterization of materials and detection of defects (Hall 5, Booth 5306).

When quality testing uses time-consuming destructive test methods, it can result in enormous costs due to damaging or destroying the products. And given that...

Im Focus: Cold molecules on collision course

Using a new cooling technique MPQ scientists succeed at observing collisions in a dense beam of cold and slow dipolar molecules.

How do chemical reactions proceed at extremely low temperatures? The answer requires the investigation of molecular samples that are cold, dense, and slow at...

Im Focus: Shrinking the proton again!

Scientists from the Max Planck Institute of Quantum Optics, using high precision laser spectroscopy of atomic hydrogen, confirm the surprisingly small value of the proton radius determined from muonic hydrogen.

It was one of the breakthroughs of the year 2010: Laser spectroscopy of muonic hydrogen resulted in a value for the proton charge radius that was significantly...

All Focus news of the innovation-report >>>

Anzeige

Anzeige

Event News

ASEAN Member States discuss the future role of renewable energy

17.10.2017 | Event News

World Health Summit 2017: International experts set the course for the future of Global Health

10.10.2017 | Event News

Climate Engineering Conference 2017 Opens in Berlin

10.10.2017 | Event News

 
Latest News

Terahertz spectroscopy goes nano

20.10.2017 | Information Technology

Strange but true: Turning a material upside down can sometimes make it softer

20.10.2017 | Materials Sciences

NRL clarifies valley polarization for electronic and optoelectronic technologies

20.10.2017 | Interdisciplinary Research

VideoLinks
B2B-VideoLinks
More VideoLinks >>>