Subject of this innovation is a silver-free paste for establishing contacts in solar cells with nickel, nickel compounds or titanium instead of silver. The process involves the local opening of the dielectric layer at moderate temperatures, thereby allowing the nickel particles in the paste to form nickel silicide with the surface of the silicon substrate. The high-energy-step of firing the silver contacts with glass frit can be dispensed with. Furthermore, it is possible to strengthen the nickel layer with copper or tin to increase the electrical conductivity of the contacts still further.
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