CEA-Léti and Fraunhofer Microelectronics Alliance (VµE), two of the largest organizations for applied research in the field of micro and nanoelectronics in Europe, have signed an extension of their 2003 cooperation agreement, now including front-end technologies for micro and nanoelectronics.
The document was signed in a ceremony on the occasion of the Annual Conference 2004 of Fraunhofer IISB in Erlangen, Germany, competence center for front-end technologies within the VµE. CEA-Léti was represented by its director Bernard Bar-bier, and VµE by Herbert Reichl, head of the VµE steering committee.
While the initial agreement, which had been signed in September 2003, covered cooperation on wafer level packaging and heterogeneous integration - the so-called "back-end" - the current extension adds "front-end technologies for micro and nanoelectronics, encompassing processes/equipment, simulation, characterization, and new materials". As a result, the cooperation agreement now includes practically all crucial aspects of semiconductor technology for micro and nanoelectronics, paving the way for a successful European cooperation in an economically but also socially extremely important field of research and development, characterized by harsh inter-national competition.
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