Replacing lead-based solder
Electrically conductive adhesive (ECA) materials offer the electronics industry an alternative to the tin-lead solder now used for connecting display driver chips, memory chips and other devices to circuit boards. But before these materials find broad application in high-end electronic equipment, researchers will have to overcome technical challenges that include low current density.
Using self-assembled monolayers – essentially molecular wires – and a three-part anti-corrosion strategy, researchers at the Georgia Institute of Technology have made significant advances toward solving those problems. At the 229th national meeting of the American Chemical Society on March 13th, the researchers will describe improvements that could allow ECA materials to conduct electrical current as well as the metal alloy solders they are designed to replace.
John Toon | EurekAlert!
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At the 2018 ILA Berlin Air Show from April 25–29, the Fraunhofer Institute for Laser Technology ILT is showcasing extreme high-speed Laser Material Deposition (EHLA): A video documents how for metal components that are highly loaded, EHLA has already proved itself as an alternative to hard chrome plating, which is now allowed only under special conditions.
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At the ILA Berlin, hall 4, booth 202, Fraunhofer FHR will present two radar sensors for navigation support of drones. The sensors are valuable components in the implementation of autonomous flying drones: they function as obstacle detectors to prevent collisions. Radar sensors also operate reliably in restricted visibility, e.g. in foggy or dusty conditions. Due to their ability to measure distances with high precision, the radar sensors can also be used as altimeters when other sources of information such as barometers or GPS are not available or cannot operate optimally.
Drones play an increasingly important role in the area of logistics and services. Well-known logistic companies place great hope in these compact, aerial...
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