Process, device, and circuit simulation tools are essential in reducing time to market and the cost of new microchip technology development, delivering faster computers, better consumer products and fueling the digital economy.
Simulation example for distribution of switching voltage of an advanced CMOS transistor due to focus variations in optical lithography
The International Technology Roadmap for Semiconductors (ITRS) estimates that the use of such tools reduces chip development times and costs by about 40%. Advanced semiconductor devices and circuits are increasingly affected by different kinds of variations which occur during the process of chip fabrication.Within the European project SUPERTHEME, a tool chain for the simulation of the impact of process variations on the devices, circuits and systems fabricated will be developed. This will allow the global semiconductor industry to minimize the detrimental effects of such variations on chips used e.g. in computers, tablets and mobile phones.
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16.01.2017 | Harvard John A. Paulson School of Engineering and Applied Sciences
An important step towards a completely new experimental access to quantum physics has been made at University of Konstanz. The team of scientists headed by...
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Researchers from the University of Hamburg in Germany, in collaboration with colleagues from the University of Aarhus in Denmark, have synthesized a new superconducting material by growing a few layers of an antiferromagnetic transition-metal chalcogenide on a bismuth-based topological insulator, both being non-superconducting materials.
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Among the general public, solar thermal energy is currently associated with dark blue, rectangular collectors on building roofs. Technologies are needed for aesthetically high quality architecture which offer the architect more room for manoeuvre when it comes to low- and plus-energy buildings. With the “ArKol” project, researchers at Fraunhofer ISE together with partners are currently developing two façade collectors for solar thermal energy generation, which permit a high degree of design flexibility: a strip collector for opaque façade sections and a solar thermal blind for transparent sections. The current state of the two developments will be presented at the BAU 2017 trade fair.
As part of the “ArKol – development of architecturally highly integrated façade collectors with heat pipes” project, Fraunhofer ISE together with its partners...
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