Etching solution for matt etching of silicon substrates
In the semiconductor industry the surfaces of silicon substrates are roughened in order to maximise the bonding of the additional layers required and the bonding of the layers to each other. In the solar industry the surfaces are matted to increase the efficiency of the process or reduce the reflection of Si wafers. The new method for matt etching silicon substrates is characterised by the fact that a water-binding agent and a buffer containing fluoride ions are added to a mineral acid mixture consisting of highly concentrated acids.
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