The technology, called Laser-Enabled Advanced Packaging (LEAP™), has the potential to enable high-volume handling, placement and interconnection of microelectronic components smaller than ever before possible.
LEAP™ is a comprehensive wafer-to-product electronic packaging technology for high-throughput, low-cost, contactless assembly of ultrathin semiconductor chips onto rigid and flexible substrates. The technology has been under development by the Advanced Electronics Packaging research group at the North Dakota State University Center for Nanoscale Science and Engineering (CNSE), Fargo, N. D., since 2008.
Recently the NDSU researchers successfully implemented the LEAP™ technology to fabricate the first-ever functional electronic device with a laser-assembled, ultra-thin silicon chip embedded in a flexible substrate. The research group is led by Dr. Val Marinov, associate professor of manufacturing engineering; and includes Dr. Orven Swenson, associate professor of physics at NDSU; Ross Miller, research engineer apprentice; and CNSE research staff, graduate students and undergraduate research assistants.
“The LEAP™ technology and tmSLADT™ process are important because they potentially enable a new class of inexpensive electronic devices by the high-volume placement and interconnection of various types of ultra-thin, fine pitch, active and passive circuit components,” said Aaron Reinholz, associate director for electronics technology at NDSU CNSE. “These types of components are especially of interest for flex substrate electronics, as they allow devices to bend, roll and be manipulated into complex geometries.”
Reinholz said application of the LEAP™ technology offers a new paradigm for numerous types of flexible and potentially disposable microelectronic devices, such as garment-integrated RFID tags, intelligent sensors platforms, and self-adapting conformal antennas. He added that this technology has strong potential in the near future outside of defense applications to reduce the unit cost of high volume single-chip devices such as RFID tags, smart cards, chip-and-pin bank cards and “smart” bank notes. According to CNSE researchers, the tmSLADT™ process also has potential value in microelectromechanical systems (MEMS) fabrication or other micro-assembly applications.
The LEAP™ technology is outlined in “Laser-Enabled Advanced Packaging of Ultrathin Bare Dice in Flexible Substrates” which has been accepted for publication by IEEE Transactions on Components, Packaging and Manufacturing Technology, manuscript TCPMT-2011-105. Another manuscript, “Noncontact Selective Laser-Assisted Placement of Thinned Semiconductor Dice,” is currently under peer review.
This material is based on research sponsored by the Defense Microelectronics Activity (DMEA) under agreement number H94003-11-2-1102. This press release does not necessarily reflect the position or the policy of the Government and no official endorsement should be inferred.
For more information, contact email@example.comAbout NDSU CNSE
Aaron Reinholz | Newswise Science News
A smart safe rechargeable zinc ion battery based on sol-gel transition electrolytes
20.07.2018 | Science China Press
Future electronic components to be printed like newspapers
20.07.2018 | Purdue University
A new manufacturing technique uses a process similar to newspaper printing to form smoother and more flexible metals for making ultrafast electronic devices.
The low-cost process, developed by Purdue University researchers, combines tools already used in industry for manufacturing metals on a large scale, but uses...
For the first time ever, scientists have determined the cosmic origin of highest-energy neutrinos. A research group led by IceCube scientist Elisa Resconi, spokesperson of the Collaborative Research Center SFB1258 at the Technical University of Munich (TUM), provides an important piece of evidence that the particles detected by the IceCube neutrino telescope at the South Pole originate from a galaxy four billion light-years away from Earth.
To rule out other origins with certainty, the team led by neutrino physicist Elisa Resconi from the Technical University of Munich and multi-wavelength...
For the first time a team of researchers have discovered two different phases of magnetic skyrmions in a single material. Physicists of the Technical Universities of Munich and Dresden and the University of Cologne can now better study and understand the properties of these magnetic structures, which are important for both basic research and applications.
Whirlpools are an everyday experience in a bath tub: When the water is drained a circular vortex is formed. Typically, such whirls are rather stable. Similar...
Physicists working with Roland Wester at the University of Innsbruck have investigated if and how chemical reactions can be influenced by targeted vibrational excitation of the reactants. They were able to demonstrate that excitation with a laser beam does not affect the efficiency of a chemical exchange reaction and that the excited molecular group acts only as a spectator in the reaction.
A frequently used reaction in organic chemistry is nucleophilic substitution. It plays, for example, an important role in in the synthesis of new chemical...
Optical spectroscopy allows investigating the energy structure and dynamic properties of complex quantum systems. Researchers from the University of Würzburg present two new approaches of coherent two-dimensional spectroscopy.
"Put an excitation into the system and observe how it evolves." According to physicist Professor Tobias Brixner, this is the credo of optical spectroscopy....
13.07.2018 | Event News
12.07.2018 | Event News
03.07.2018 | Event News
20.07.2018 | Power and Electrical Engineering
20.07.2018 | Information Technology
20.07.2018 | Materials Sciences