Despite continuous technical advances in the semiconductor industry, microchips are still composed of laterally-arranged (side-by-side) transistors on a silicon substrate. EUREKA project E! 2259 VSI developed new ways to break through this two dimensional approach and the restrictions it imposes by designing 3-D chips or Vertical System Integration (VSI).
This technology has immediate security benefits which are very desirable since chip cards often contain secure information or monetary values and, therefore, are subject to attack by hackers. “With the new technology, the top sides of the chips are inside the 3-D stack and therefore not accessible to mechanical attacks, electrical probing or a lot of other physical attacks,” says Wolfgang Gruber of Infineon Technologies AG, the German lead partner.
Infineon appreciates the co-operation a EUREKA project brings. "EUREKA helped us to find an equipment manufacturer with the necessary know how and skills that are only available in a few companies around the world," explains Gruber. "The EUREKA label is a quality label most people associate with a sophisticated research project of high quality – a big advantage when it comes to convincing someone about your ideas!”
Nicola Vatthauer | alfa
21.08.2017 | Albert-Ludwigs-Universität Freiburg im Breisgau
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A study led by scientists of the Max Planck Institute for the Structure and Dynamics of Matter (MPSD) at the Center for Free-Electron Laser Science in Hamburg presents evidence of the coexistence of superconductivity and “charge-density-waves” in compounds of the poorly-studied family of bismuthates. This observation opens up new perspectives for a deeper understanding of the phenomenon of high-temperature superconductivity, a topic which is at the core of condensed matter research since more than 30 years. The paper by Nicoletti et al has been published in the PNAS.
Since the beginning of the 20th century, superconductivity had been observed in some metals at temperatures only a few degrees above the absolute zero (minus...
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