Forum for Science, Industry and Business

Sponsored by:     3M 
Search our Site:

 

Breaking Into The Third Dimension Of Computer Chip Design

26.11.2003


Despite continuous technical advances in the semiconductor industry, microchips are still composed of laterally-arranged (side-by-side) transistors on a silicon substrate. EUREKA project E! 2259 VSI developed new ways to break through this two dimensional approach and the restrictions it imposes by designing 3-D chips or Vertical System Integration (VSI).



This technology has immediate security benefits which are very desirable since chip cards often contain secure information or monetary values and, therefore, are subject to attack by hackers. “With the new technology, the top sides of the chips are inside the 3-D stack and therefore not accessible to mechanical attacks, electrical probing or a lot of other physical attacks,” says Wolfgang Gruber of Infineon Technologies AG, the German lead partner.

Infineon appreciates the co-operation a EUREKA project brings. "EUREKA helped us to find an equipment manufacturer with the necessary know how and skills that are only available in a few companies around the world," explains Gruber. "The EUREKA label is a quality label most people associate with a sophisticated research project of high quality – a big advantage when it comes to convincing someone about your ideas!”


Increased flexibility

Using the 3-D chips, it is cheaper and easier to realise mixed technologies in a range of applications such as next-generation 3G mobile phones, smart cards and ’intelligent cars’.

The Austrian partner Datacon developed the machinery to construct the 3-D chips. “Through our close co-operation with Infineon we were able to produce a machine that could exceed the state-of-the-art in terms of production speed and accuracy,” says Christoph Scheiring, Manager of Advanced Technology at Datacon.

The partners have developed two versions of the 3-D stacking. The first will be ready for production in 2004, and is “a cost-efficient, two-layer technology called ’Solid Face to Face’ (F2F), in which one or more chips are attached and in contact with a base chip by a soldering process.” Gruber explains, “a demonstration chip card with a huge amount of memory capable of fulfilling requirements for future multi-application operating systems has been built.”

Work continues on the second version - a multi-layer technology based on F2F that will allow for wiring through a chip to the next chip, thus making stacks of three or more layers possible and further increasing the chip’s flexibility and security. This is due to be ready for production in 2007.

Nicola Vatthauer | alfa
Further information:
http://www.eureka.be/success-stories

More articles from Information Technology:

nachricht Optical fiber transmits one terabit per second – Novel modulation approach
16.09.2016 | Technische Universität München

nachricht Researchers prototype system for reading closed books
09.09.2016 | Massachusetts Institute of Technology

All articles from Information Technology >>>

The most recent press releases about innovation >>>

Die letzten 5 Focus-News des innovations-reports im Überblick:

Im Focus: OLED microdisplays in data glasses for improved human-machine interaction

The Fraunhofer Institute for Organic Electronics, Electron Beam and Plasma Technology FEP has been developing various applications for OLED microdisplays based on organic semiconductors. By integrating the capabilities of an image sensor directly into the microdisplay, eye movements can be recorded by the smart glasses and utilized for guidance and control functions, as one example. The new design will be debuted at Augmented World Expo Europe (AWE) in Berlin at Booth B25, October 18th – 19th.

“Augmented-reality” and “wearables” have become terms we encounter almost daily. Both can make daily life a little simpler and provide valuable assistance for...

Im Focus: Artificial Intelligence Helps in the Discovery of New Materials

With the help of artificial intelligence, chemists from the University of Basel in Switzerland have computed the characteristics of about two million crystals made up of four chemical elements. The researchers were able to identify 90 previously unknown thermodynamically stable crystals that can be regarded as new materials. They report on their findings in the scientific journal Physical Review Letters.

Elpasolite is a glassy, transparent, shiny and soft mineral with a cubic crystal structure. First discovered in El Paso County (Colorado, USA), it can also be...

Im Focus: Complex hardmetal tools out of the 3D printer

For the first time, Fraunhofer IKTS shows additively manufactured hardmetal tools at WorldPM 2016 in Hamburg. Mechanical, chemical as well as a high heat resistance and extreme hardness are required from tools that are used in mechanical and automotive engineering or in plastics and building materials industry. Researchers at the Fraunhofer Institute for Ceramic Technologies and Systems IKTS in Dresden managed the production of complex hardmetal tools via 3D printing in a quality that are in no way inferior to conventionally produced high-performance tools.

Fraunhofer IKTS counts decades of proven expertise in the development of hardmetals. To date, reliable cutting, drilling, pressing and stamping tools made of...

Im Focus: Launch of New Industry Working Group for Process Control in Laser Material Processing

At AKL’16, the International Laser Technology Congress held in May this year, interest in the topic of process control was greater than expected. Appropriately, the event was also used to launch the Industry Working Group for Process Control in Laser Material Processing. The group provides a forum for representatives from industry and research to initiate pre-competitive projects and discuss issues such as standards, potential cost savings and feasibility.

In the age of industry 4.0, laser technology is firmly established within manufacturing. A wide variety of laser techniques – from USP ablation and additive...

Im Focus: New laser joining technologies at ‘K 2016’ trade fair

Every three years, the plastics industry gathers at K, the international trade fair for plastics and rubber in Düsseldorf. The Fraunhofer Institute for Laser Technology ILT will also be attending again and presenting many innovative technologies, such as for joining plastics and metals using ultrashort pulse lasers. From October 19 to 26, you can find the Fraunhofer ILT at the joint Fraunhofer booth SC01 in Hall 7.

K is the world’s largest trade fair for the plastics and rubber industry. As in previous years, the organizers are expecting 3,000 exhibitors and more than...

All Focus news of the innovation-report >>>

Anzeige

Anzeige

Event News

Experts from industry and academia discuss the future mobile telecommunications standard 5G

23.09.2016 | Event News

ICPE in Graz for the seventh time

20.09.2016 | Event News

Using mathematical models to understand our brain

16.09.2016 | Event News

 
Latest News

Stronger turbine blades with molybdenum silicides

26.09.2016 | Materials Sciences

Scientists Find Twisting 3-D Raceway for Electrons in Nanoscale Crystal Slices

26.09.2016 | Materials Sciences

Lowering the Heat Makes New Materials Possible While Saving Energy

26.09.2016 | Materials Sciences

VideoLinks
B2B-VideoLinks
More VideoLinks >>>