Forum for Science, Industry and Business

Sponsored by:     3M 
Search our Site:

 

Breaking Into The Third Dimension Of Computer Chip Design

26.11.2003


Despite continuous technical advances in the semiconductor industry, microchips are still composed of laterally-arranged (side-by-side) transistors on a silicon substrate. EUREKA project E! 2259 VSI developed new ways to break through this two dimensional approach and the restrictions it imposes by designing 3-D chips or Vertical System Integration (VSI).



This technology has immediate security benefits which are very desirable since chip cards often contain secure information or monetary values and, therefore, are subject to attack by hackers. “With the new technology, the top sides of the chips are inside the 3-D stack and therefore not accessible to mechanical attacks, electrical probing or a lot of other physical attacks,” says Wolfgang Gruber of Infineon Technologies AG, the German lead partner.

Infineon appreciates the co-operation a EUREKA project brings. "EUREKA helped us to find an equipment manufacturer with the necessary know how and skills that are only available in a few companies around the world," explains Gruber. "The EUREKA label is a quality label most people associate with a sophisticated research project of high quality – a big advantage when it comes to convincing someone about your ideas!”


Increased flexibility

Using the 3-D chips, it is cheaper and easier to realise mixed technologies in a range of applications such as next-generation 3G mobile phones, smart cards and ’intelligent cars’.

The Austrian partner Datacon developed the machinery to construct the 3-D chips. “Through our close co-operation with Infineon we were able to produce a machine that could exceed the state-of-the-art in terms of production speed and accuracy,” says Christoph Scheiring, Manager of Advanced Technology at Datacon.

The partners have developed two versions of the 3-D stacking. The first will be ready for production in 2004, and is “a cost-efficient, two-layer technology called ’Solid Face to Face’ (F2F), in which one or more chips are attached and in contact with a base chip by a soldering process.” Gruber explains, “a demonstration chip card with a huge amount of memory capable of fulfilling requirements for future multi-application operating systems has been built.”

Work continues on the second version - a multi-layer technology based on F2F that will allow for wiring through a chip to the next chip, thus making stacks of three or more layers possible and further increasing the chip’s flexibility and security. This is due to be ready for production in 2007.

Nicola Vatthauer | alfa
Further information:
http://www.eureka.be/success-stories

More articles from Information Technology:

nachricht World's thinnest hologram paves path to new 3-D world
18.05.2017 | RMIT University

nachricht Internet of things made simple: One sensor package does work of many
11.05.2017 | Carnegie Mellon University

All articles from Information Technology >>>

The most recent press releases about innovation >>>

Die letzten 5 Focus-News des innovations-reports im Überblick:

Im Focus: Turmoil in sluggish electrons’ existence

An international team of physicists has monitored the scattering behaviour of electrons in a non-conducting material in real-time. Their insights could be beneficial for radiotherapy.

We can refer to electrons in non-conducting materials as ‘sluggish’. Typically, they remain fixed in a location, deep inside an atomic composite. It is hence...

Im Focus: Wafer-thin Magnetic Materials Developed for Future Quantum Technologies

Two-dimensional magnetic structures are regarded as a promising material for new types of data storage, since the magnetic properties of individual molecular building blocks can be investigated and modified. For the first time, researchers have now produced a wafer-thin ferrimagnet, in which molecules with different magnetic centers arrange themselves on a gold surface to form a checkerboard pattern. Scientists at the Swiss Nanoscience Institute at the University of Basel and the Paul Scherrer Institute published their findings in the journal Nature Communications.

Ferrimagnets are composed of two centers which are magnetized at different strengths and point in opposing directions. Two-dimensional, quasi-flat ferrimagnets...

Im Focus: World's thinnest hologram paves path to new 3-D world

Nano-hologram paves way for integration of 3-D holography into everyday electronics

An Australian-Chinese research team has created the world's thinnest hologram, paving the way towards the integration of 3D holography into everyday...

Im Focus: Using graphene to create quantum bits

In the race to produce a quantum computer, a number of projects are seeking a way to create quantum bits -- or qubits -- that are stable, meaning they are not much affected by changes in their environment. This normally needs highly nonlinear non-dissipative elements capable of functioning at very low temperatures.

In pursuit of this goal, researchers at EPFL's Laboratory of Photonics and Quantum Measurements LPQM (STI/SB), have investigated a nonlinear graphene-based...

Im Focus: Bacteria harness the lotus effect to protect themselves

Biofilms: Researchers find the causes of water-repelling properties

Dental plaque and the viscous brown slime in drainpipes are two familiar examples of bacterial biofilms. Removing such bacterial depositions from surfaces is...

All Focus news of the innovation-report >>>

Anzeige

Anzeige

Event News

AWK Aachen Machine Tool Colloquium 2017: Internet of Production for Agile Enterprises

23.05.2017 | Event News

Dortmund MST Conference presents Individualized Healthcare Solutions with micro and nanotechnology

22.05.2017 | Event News

Innovation 4.0: Shaping a humane fourth industrial revolution

17.05.2017 | Event News

 
Latest News

Supercomputing helps researchers understand Earth's interior

23.05.2017 | Earth Sciences

Study identifies RNA molecule that shields breast cancer stem cells from immune system

23.05.2017 | Life Sciences

Turmoil in sluggish electrons’ existence

23.05.2017 | Physics and Astronomy

VideoLinks
B2B-VideoLinks
More VideoLinks >>>