Users rather move data to the cloud than purchasing another external storage medium. So far, no satisfactory solutions exist in terms of data security, so providers and users of cloud computing do not really have a trusting relationship.
On top of that, the classic encryption methods are suitable for data storage, but only in a very limited degree for further processing of security-critical data.
The EU project TRESCCA, which is coordinated by the German OFFIS - Institute for Information Technology, applies itself since October 2012 to the solution of these problems. The objective of the project is to secure network-enabled edge devices against software and hardware-based attacks.
By use of hardware security modules and virtualization with live migration to isolate individual processes, the basis for a secure and trusted cloud platform is created. Safety-critical applications can run in a secure environment on the user side and non-safety-critical ones can be outsourced to the cloud safely.
By doing so, the cloud provider can make sure that applications on the client side, such as smart metering are not compromised. The project develops and demonstrates a hardware / software solution that allows future users to delegate safety-critical tasks to external providers. Thus opens a whole new area of cloud services.
TRESCCA will last 36 months and is now starting after the successful kick-off meeting in early October in the first phase. The other international partners from science and industry are CoSynth GmbH, Institut Telecom-Mines, Virtual Open Systems SARL, Technological Educational Institute of Crete, ST Microelectronics Grenoble 2 SAS, Wellness Telecom SL. By involving an advisory board the project faces the external discourse.
Stanford researchers create new special-purpose computer that may someday save us billions
21.10.2016 | Stanford University
New 3-D wiring technique brings scalable quantum computers closer to reality
19.10.2016 | University of Waterloo
Researchers from the Institute for Quantum Computing (IQC) at the University of Waterloo led the development of a new extensible wiring technique capable of controlling superconducting quantum bits, representing a significant step towards to the realization of a scalable quantum computer.
"The quantum socket is a wiring method that uses three-dimensional wires based on spring-loaded pins to address individual qubits," said Jeremy Béjanin, a PhD...
In a paper in Scientific Reports, a research team at Worcester Polytechnic Institute describes a novel light-activated phenomenon that could become the basis for applications as diverse as microscopic robotic grippers and more efficient solar cells.
A research team at Worcester Polytechnic Institute (WPI) has developed a revolutionary, light-activated semiconductor nanocomposite material that can be used...
By forcefully embedding two silicon atoms in a diamond matrix, Sandia researchers have demonstrated for the first time on a single chip all the components needed to create a quantum bridge to link quantum computers together.
"People have already built small quantum computers," says Sandia researcher Ryan Camacho. "Maybe the first useful one won't be a single giant quantum computer...
COMPAMED has become the leading international marketplace for suppliers of medical manufacturing. The trade fair, which takes place every November and is co-located to MEDICA in Dusseldorf, has been steadily growing over the past years and shows that medical technology remains a rapidly growing market.
In 2016, the joint pavilion by the IVAM Microtechnology Network, the Product Market “High-tech for Medical Devices”, will be located in Hall 8a again and will...
'Ferroelectric' materials can switch between different states of electrical polarization in response to an external electric field. This flexibility means they show promise for many applications, for example in electronic devices and computer memory. Current ferroelectric materials are highly valued for their thermal and chemical stability and rapid electro-mechanical responses, but creating a material that is scalable down to the tiny sizes needed for technologies like silicon-based semiconductors (Si-based CMOS) has proven challenging.
Now, Hiroshi Funakubo and co-workers at the Tokyo Institute of Technology, in collaboration with researchers across Japan, have conducted experiments to...
14.10.2016 | Event News
14.10.2016 | Event News
12.10.2016 | Event News
21.10.2016 | Health and Medicine
21.10.2016 | Information Technology
21.10.2016 | Materials Sciences