Forum for Science, Industry and Business

Sponsored by:     3M 
Search our Site:


Compact 24 volt power supplies with high performance but low space requirements

Siemens's Industry Automation Division has added a new compact 40 ampere basic unit to its Sitop modular power supply series.

It is only 150 millimeters wide, which is 90 millimeters narrower than the previous unit. The 20 ampere power supply has also been renewed and is only 70 millimeters wide.

The two Sitop PSU300M standard mounting rail power supplies for connection to 3-phase 400-500 volt AC networks now have a wider range input (from 320 to 575 volt AC) than previous versions. This enables them to be used in almost all the world's 3-phase networks, and they provide a reliable 24 volt supply even when there are large deviations in the voltage supply. The user now simply evaluates the "DC 24 V OK" operating mode via the new, integrated dry signaling contact.

The new 40 ampere power supply is a substantial improvement on the previous model. Apart from its small dimensions, the power unit now supplies 60 amperes for five seconds, so it can easily switch on even terminal equipment with high starting currents. Its efficiency of up to 93 percent reduces energy consumption and heat build-up in the control cabinet

Like all Sitop basic units in the modular series, the new Sitop PSU300M standard mounting rail power supplies also have rugged metal enclosures. They can provide up to three times the rated current to meet short-term peak power demands. Moreover, the short-circuit response can be set with the options: latching shutdown or constant current with automatic re-ramp up to the output voltage. Used in combination with Sitop add-on modules, comprehensive protection can be achieved against primary and secondary disturbances.

Gerhard Stauss | Siemens Industry Automation
Further information:

More articles from Machine Engineering:

nachricht Process-Integrated Inspection for Ultrasound-Supported Friction Stir Welding of Metal Hybrid-Joints
27.09.2016 | Fraunhofer-Institut für Zerstörungsfreie Prüfverfahren IZFP

nachricht Lightweight robots in manual assembly
13.09.2016 | Fraunhofer-Institut für Arbeitswirtschaft und Organisation IAO

All articles from Machine Engineering >>>

The most recent press releases about innovation >>>

Die letzten 5 Focus-News des innovations-reports im Überblick:

Im Focus: New 3-D wiring technique brings scalable quantum computers closer to reality

Researchers from the Institute for Quantum Computing (IQC) at the University of Waterloo led the development of a new extensible wiring technique capable of controlling superconducting quantum bits, representing a significant step towards to the realization of a scalable quantum computer.

"The quantum socket is a wiring method that uses three-dimensional wires based on spring-loaded pins to address individual qubits," said Jeremy Béjanin, a PhD...

Im Focus: Scientists develop a semiconductor nanocomposite material that moves in response to light

In a paper in Scientific Reports, a research team at Worcester Polytechnic Institute describes a novel light-activated phenomenon that could become the basis for applications as diverse as microscopic robotic grippers and more efficient solar cells.

A research team at Worcester Polytechnic Institute (WPI) has developed a revolutionary, light-activated semiconductor nanocomposite material that can be used...

Im Focus: Diamonds aren't forever: Sandia, Harvard team create first quantum computer bridge

By forcefully embedding two silicon atoms in a diamond matrix, Sandia researchers have demonstrated for the first time on a single chip all the components needed to create a quantum bridge to link quantum computers together.

"People have already built small quantum computers," says Sandia researcher Ryan Camacho. "Maybe the first useful one won't be a single giant quantum computer...

Im Focus: New Products - Highlights of COMPAMED 2016

COMPAMED has become the leading international marketplace for suppliers of medical manufacturing. The trade fair, which takes place every November and is co-located to MEDICA in Dusseldorf, has been steadily growing over the past years and shows that medical technology remains a rapidly growing market.

In 2016, the joint pavilion by the IVAM Microtechnology Network, the Product Market “High-tech for Medical Devices”, will be located in Hall 8a again and will...

Im Focus: Ultra-thin ferroelectric material for next-generation electronics

'Ferroelectric' materials can switch between different states of electrical polarization in response to an external electric field. This flexibility means they show promise for many applications, for example in electronic devices and computer memory. Current ferroelectric materials are highly valued for their thermal and chemical stability and rapid electro-mechanical responses, but creating a material that is scalable down to the tiny sizes needed for technologies like silicon-based semiconductors (Si-based CMOS) has proven challenging.

Now, Hiroshi Funakubo and co-workers at the Tokyo Institute of Technology, in collaboration with researchers across Japan, have conducted experiments to...

All Focus news of the innovation-report >>>



Event News

#IC2S2: When Social Science meets Computer Science - GESIS will host the IC2S2 conference 2017

14.10.2016 | Event News

Agricultural Trade Developments and Potentials in Central Asia and the South Caucasus

14.10.2016 | Event News

World Health Summit – Day Three: A Call to Action

12.10.2016 | Event News

Latest News

Resolving the mystery of preeclampsia

21.10.2016 | Health and Medicine

Stanford researchers create new special-purpose computer that may someday save us billions

21.10.2016 | Information Technology

From ancient fossils to future cars

21.10.2016 | Materials Sciences

More VideoLinks >>>