A case study by researchers in the Center for Nanoscale Science and Engineering (CNSE) at North Dakota State University was published in the July 2008 issue of the Chip Scale Review magazine.
“Case Study: Building a Two-Chip Stacked Package” is authored by Fred Haring, research technician; Chris Hoffarth, engineering technician; Syed Sajid Ahmad, manager of engineering services; John Jacobson, senior design engineer; and Aaron Reinholz, associate director of electronics technology. CNSE staff members Linda Leick, Darci Hansen, Matt Sharpe and Meridith Bell also contributed significantly to the project.
With the increasing demand for more functionality and smaller size with portable devices such as cell phones, mp3 players, and GPS units, the performance and size of individual electronic components have become critical. The case study details how CNSE researchers design and manufacture a chip scale package. Engineering a single package housing multiple chips stacked vertically one on top of the other results in smaller and more efficient packages for devices. For example, CNSE researchers have successfully reduced the size of two electronics components by 75 percent.
Two or more processors packaged in a single package will result in an overall package size smaller than each individual package, yet will have the combined computing power of the two individual integrated processors. The case study walks through this two-chip stacked package process at CNSE, discussing stacked-die design considerations, substrate limitations, stack configuration, assembly process, process documentation, wire bonding, laser marking, ball attaching, singulation, inspection, testing, and hallmark successes of system completion.
The case study is found at http://www.chipscalereview.com/issues/0708/index.phpAbout the NDSU authors
Chris Hoffarth received his associate’s degree in electronics technology from North Dakota State College of Science, Wahpeton, N.D. Hoffarth was a surface mount technician at Vancsco Electronics in Valley City, N.D., before joining CNSE at NDSU in 2005. He manages the surface mount technology and chip scale package lines.
Syed Sajid Ahmad received his master’s degree in experimental physics from the University of the Punjab and his master’s degree in theoretical physics from Islamabad University, Pakistan. Ahmad was employed by Micron Technology conducting development and implementation of advanced packaging prior to joining CNSE at NDSU in 2003. At CNSE, he manages the research and manufacturing capabilities in the areas of thin film, thick film, chip scale packaging and surface mount technology.
John Jacobson received his bachelor’s degree in electronics technology from Arizona State University, Tempe. Prior to joining CNSE at NDSU in 2004, Jacobson served as a materials engineer at Micron Technology, Boise, Idaho. He leads design and electrical modeling of chip scale packaging efforts.
Aaron Reinholz received his bachelor’s degree in electrical engineering from NDSU. Prior to joining CNSE at NDSU in 2004, Reinholz served as an engineer at Rockwell Collins, Inc., Cedar Rapids, Iowa, for 13 years. He directs the CNSE engineering organization overseeing engineering services, coordinating industry partners, executing multiple projects and managing laboratory space. http://www.ndsu.edu/cnseAbout Chip Scale Review
Carol Renner | Newswise Science News
Researchers create new technique for manipulating polarization of terahertz radiation
20.07.2017 | Brown University
Holograms taken to new dimension
19.07.2017 | University of Utah
Physicists have developed a new technique that uses electrical voltages to control the electron spin on a chip. The newly-developed method provides protection from spin decay, meaning that the contained information can be maintained and transmitted over comparatively large distances, as has been demonstrated by a team from the University of Basel’s Department of Physics and the Swiss Nanoscience Institute. The results have been published in Physical Review X.
For several years, researchers have been trying to use the spin of an electron to store and transmit information. The spin of each electron is always coupled...
What is the mass of a proton? Scientists from Germany and Japan successfully did an important step towards the most exact knowledge of this fundamental constant. By means of precision measurements on a single proton, they could improve the precision by a factor of three and also correct the existing value.
To determine the mass of a single proton still more accurate – a group of physicists led by Klaus Blaum and Sven Sturm of the Max Planck Institute for Nuclear...
The research team of Prof. Dr. Oliver Einsle at the University of Freiburg's Institute of Biochemistry has long been exploring the functioning of nitrogenase....
A one trillion tonne iceberg - one of the biggest ever recorded -- has calved away from the Larsen C Ice Shelf in Antarctica, after a rift in the ice,...
Physics supports biology: Researchers from PTB have developed a model system to investigate friction phenomena with atomic precision
Friction: what you want from car brakes, otherwise rather a nuisance. In any case, it is useful to know as precisely as possible how friction phenomena arise –...
19.07.2017 | Event News
12.07.2017 | Event News
12.07.2017 | Event News
20.07.2017 | Information Technology
20.07.2017 | Materials Sciences
20.07.2017 | Physics and Astronomy