Forum for Science, Industry and Business

Sponsored by:     3M 
Search our Site:

 

Copper’s not coping: new chips call on light speed

21.01.2008
The tiny copper wires that connect different areas of an integrated circuit may soon limit microchip-processing speeds. So European researchers have developed technologies to produce and combine semiconductor microlasers with silicon wave guides for novel, power-efficient optical connections.

We have all experienced the effect of Moore's Law: almost from the second you unpack a newly purchased computer it is already outdated. The next model – with faster processing power and more advanced features – is already in the shop.

Gordon E. Moore, co-founder of Intel, described the phenomenon of microchip miniaturisation in 1965 when he observed that the number of transistors you can fit into an integrated circuit appeared to double about every two years.

The microelectronics industry still follows this “law”, but unless new fabrication or microprocessing technologies are quickly developed this relentless miniaturisation may peter out in less than a decade. Microchips based on silicon wafers are nearing their theoretical limits as physical properties of near nanoscale silicon integrated circuits begin to interfere with their performance.

The speed of data transfer within integrated circuits is one of the major bottlenecks. At present, to pass information from one part of a chip to another, the data packet is sent as electrons through copper wires, known as copper interconnects.

These wires may be just a few millimetres in length, but for the electrons it is like running between underground trains at rush hour. The electrons must all squeeze down narrow tunnels while a crowd backs up at the entrance.

Copper can’t cope
“Copper-wire interconnects place serious limitations on the performance of silicon integrated circuits,” says Dries Van Thourhout from Ghent University's Photonics Research Group and Belgium's micro- and nanoelectronics research centre IMEC. “It is hard to transmit data down these interconnects in a sufficiently fast, power-efficient way. It is a problem of bandwidth and copper will not be able to cope with the processing power of tomorrow's microchips.”

Optical interconnects use light instead of electrons to represent information; they are a highly appealing alternative to copper interconnects, with the potential to be far more efficient, transmitting more data but using the same or even less power.

Instead of travelling along copper wires, photons travel the distance between source and detector along wave guides, like miniature optical fibres. At this scale, however, the wave guides are made out of silicon rather than glass.

“Lots of research has shown that you can etch wave guides for photons into silicon,” says Van Thourhout. “This is great because you are using the same materials and fabrication technologies as you do to make integrated circuits. But there is one significant drawback: it is extremely hard to get light out of silicon.”

Despite extensive research to exploit many of silicon's peculiar properties, it is highly unlikely that purely silicon-based lasers will reach an efficiency comparable to that of their semiconductor-based cousins for the foreseeable future.

Van Thourhout has coordinated a European consortium that has successfully combined the best of both worlds: silicon wave guides and microscale lasers made from a semiconductor call indium-phosphate. The PICMOS project was a partnership between several European research institutions, universities and two French companies STMicroelectronics and TRACIT Technologies, now owned by Soitec.

Mini-laser system
Part of the research involved the fabrication of a miniaturised laser system small enough to generate light for each interconnect. The PICMOS partners developed a method to etch indium-phosphate lasers with a diameter of just 7µm, sufficiently small to integrate several thousand onto a 2cm x 2cm silicon chip. This is the first time that such compact lasers have been produced in a very practical, cost-efficient way.

The tiny lasers could also have applications in miniature optical sensors, such as strain detectors, or be used to build incredibly cheap, but very powerful optical biosensors. But the biggest breakthrough in the project was the development of a bonding technology that joins the silicon and iridium-phosphate materials together.

“The bonding process, now transferred to TRACIT, effectively 'glues' the silicon and semiconducting indium-phosphate in layers. It is possible to etch out the microlasers and the silicon wave guides and produce an optical interconnecting layer,” says Van Thourhout. “The bonding process and the refinement of the microlaser and the accompanying detectors have been major breakthroughs.”

The production cost of the prototype optical interconnect layer is still too high for mass production, although the results from the demonstrator 'chip' have been extremely encouraging. A follow-up project, WADIMOS, will continue to drive the PICMOS platform towards commercialisation. In particular it will develop a pilot line that integrates the fabrication of the optical interconnect layer into the regular integrated circuit manufacturing process.

“We envisage a layer on an integrated circuit that sits on top of the classical etched copper electrical interconnect layer,” says Van Thourhout. “This optical interconnect layer would be less sensitive to temperature, immune from electromagnetic noise, and have lower power consumption. Meanwhile, the bonding system could be adapted for many other electronics applications, for example to stack integrated circuits and in microfluidic technologies. The application of the PICMOS platform could be tremendous for tomorrow's chip technologies and wide-ranging in many other associated applications.”

Christian Nielsen | alfa
Further information:
http://cordis.europa.eu/ictresults/index.cfm/section/news/tpl/article/BrowsingType/Features/ID/89457

More articles from Information Technology:

nachricht Construction of practical quantum computers radically simplified
05.12.2016 | University of Sussex

nachricht UT professor develops algorithm to improve online mapping of disaster areas
29.11.2016 | University of Tennessee at Knoxville

All articles from Information Technology >>>

The most recent press releases about innovation >>>

Die letzten 5 Focus-News des innovations-reports im Überblick:

Im Focus: Significantly more productivity in USP lasers

In recent years, lasers with ultrashort pulses (USP) down to the femtosecond range have become established on an industrial scale. They could advance some applications with the much-lauded “cold ablation” – if that meant they would then achieve more throughput. A new generation of process engineering that will address this issue in particular will be discussed at the “4th UKP Workshop – Ultrafast Laser Technology” in April 2017.

Even back in the 1990s, scientists were comparing materials processing with nanosecond, picosecond and femtosesecond pulses. The result was surprising:...

Im Focus: Shape matters when light meets atom

Mapping the interaction of a single atom with a single photon may inform design of quantum devices

Have you ever wondered how you see the world? Vision is about photons of light, which are packets of energy, interacting with the atoms or molecules in what...

Im Focus: Novel silicon etching technique crafts 3-D gradient refractive index micro-optics

A multi-institutional research collaboration has created a novel approach for fabricating three-dimensional micro-optics through the shape-defined formation of porous silicon (PSi), with broad impacts in integrated optoelectronics, imaging, and photovoltaics.

Working with colleagues at Stanford and The Dow Chemical Company, researchers at the University of Illinois at Urbana-Champaign fabricated 3-D birefringent...

Im Focus: Quantum Particles Form Droplets

In experiments with magnetic atoms conducted at extremely low temperatures, scientists have demonstrated a unique phase of matter: The atoms form a new type of quantum liquid or quantum droplet state. These so called quantum droplets may preserve their form in absence of external confinement because of quantum effects. The joint team of experimental physicists from Innsbruck and theoretical physicists from Hannover report on their findings in the journal Physical Review X.

“Our Quantum droplets are in the gas phase but they still drop like a rock,” explains experimental physicist Francesca Ferlaino when talking about the...

Im Focus: MADMAX: Max Planck Institute for Physics takes up axion research

The Max Planck Institute for Physics (MPP) is opening up a new research field. A workshop from November 21 - 22, 2016 will mark the start of activities for an innovative axion experiment. Axions are still only purely hypothetical particles. Their detection could solve two fundamental problems in particle physics: What dark matter consists of and why it has not yet been possible to directly observe a CP violation for the strong interaction.

The “MADMAX” project is the MPP’s commitment to axion research. Axions are so far only a theoretical prediction and are difficult to detect: on the one hand,...

All Focus news of the innovation-report >>>

Anzeige

Anzeige

Event News

ICTM Conference 2017: Production technology for turbomachine manufacturing of the future

16.11.2016 | Event News

Innovation Day Laser Technology – Laser Additive Manufacturing

01.11.2016 | Event News

#IC2S2: When Social Science meets Computer Science - GESIS will host the IC2S2 conference 2017

14.10.2016 | Event News

 
Latest News

Simple processing technique could cut cost of organic PV and wearable electronics

06.12.2016 | Materials Sciences

3-D printed kidney phantoms aid nuclear medicine dosing calibration

06.12.2016 | Medical Engineering

Robot on demand: Mobile machining of aircraft components with high precision

06.12.2016 | Power and Electrical Engineering

VideoLinks
B2B-VideoLinks
More VideoLinks >>>