The new EU-funded research project COMPLEX has started and announced details of the multinational/ multidisciplinary program: “COMPLEX – COdesing and power Management in PLatform-based design space EXploration”. The heterogeneity and complexity of embedded systems rises continuously.
This creates certain gaps and defines three main challenges a leading industry has to face. First, handle the rising complexity of execution platforms and applications, combined with the uncertainty of platform selection and application to platform mapping. Second, find the balance between increasing power consumption, possible performance, and explicit application needs. Finally, meet memory demands both in size and access times.
The mission of this 3-year project is to keep up with rapid technology advances and to decrease the impact of these gaps. Partners in COMPLEX will develop an innovative and highly efficient productive design methodology and a holistic framework for iteratively exploring the design space of embedded HW/SW systems. This requires precise estimation of performance and power consumption at the same time, demanding a framework capable to describe a complete embedded system. According to this, COMPLEX will integrate, bundle, and augment available point-tools as well as predesigned system components from different European vendors. Altogether the project will lead to the following main objectives:
- Highly efficient productive design methodology and holistic framework for design space exploration of embedded HW/SW systems. The framework will be platform and application domain independent. It will provide open interfaces for the later integration of new industry players.
- Combining and augmenting established Electronic System Level (ESL) synthesis & analysis tools into a seamless design flow, enabling performance & power aware virtual prototyping of HW/SW systems.
- Interfacing next-generation model-driven SW design approaches and industry standard model-based design environments.
- Multi-objective co-exploration for assessing design quality and optimizing the system platform with respect to performance, and power metrics.
- Fast simulation and assessment of the platform with up to bus-cycle accuracy at ESL.
- Optimization by run-time mode adaptation techniques, such as dynamic power management or application adaptation to varying workloads and iterative exploration and refinement of advanced applications.
Achieving these goals will lower existing barriers between HW and SW developers. SW designers will be able to explore various HW implementations and HW designers can hide irrelevant technical details. Nevertheless, a clear view on the results of the application code in terms of timing behaviour and power consumption will be preserved. Finally, this framework will offer cooperating developers of next-generation networked embedded systems a highly efficient design methodology and tool chain.
The COMPLEX consortium consists of leading European partners from research, industry, and the Electronic Design Automation (EDA) sector. Thus, the project’s outcome will be well connected to the next-generation system specification and design methodology. Summarized, this is the automatic generation of an efficient executable virtual system, giving accurate and reliable timing and power information, and the integration of an automatic design space exploration to find the optimal design space instance parameters. These results are expected to reinforce Europe's industrial strengths by overcoming technology roadblocks and to develop systems, respecting alternative paths to next generation technologies and sustainable development. As a consequence of this COMPLEX will lay the foundations for innovation in various major products and services. Electronic components can be built increasingly smaller, cheaper, more reliable, and less power consuming. Furthermore, the framework will allow system integrators to identify the ideal technology platform models for their customers.Contact for editorial enquiries:
Ultra-precise chip-scale sensor detects unprecedentedly small changes at the nanoscale
18.01.2017 | The Hebrew University of Jerusalem
Data analysis optimizes cyber-physical systems in telecommunications and building automation
18.01.2017 | Fraunhofer-Institut für Algorithmen und Wissenschaftliches Rechnen SCAI
An important step towards a completely new experimental access to quantum physics has been made at University of Konstanz. The team of scientists headed by...
Yersiniae cause severe intestinal infections. Studies using Yersinia pseudotuberculosis as a model organism aim to elucidate the infection mechanisms of these...
Researchers from the University of Hamburg in Germany, in collaboration with colleagues from the University of Aarhus in Denmark, have synthesized a new superconducting material by growing a few layers of an antiferromagnetic transition-metal chalcogenide on a bismuth-based topological insulator, both being non-superconducting materials.
While superconductivity and magnetism are generally believed to be mutually exclusive, surprisingly, in this new material, superconducting correlations...
Laser-driving of semimetals allows creating novel quasiparticle states within condensed matter systems and switching between different states on ultrafast time scales
Studying properties of fundamental particles in condensed matter systems is a promising approach to quantum field theory. Quasiparticles offer the opportunity...
Among the general public, solar thermal energy is currently associated with dark blue, rectangular collectors on building roofs. Technologies are needed for aesthetically high quality architecture which offer the architect more room for manoeuvre when it comes to low- and plus-energy buildings. With the “ArKol” project, researchers at Fraunhofer ISE together with partners are currently developing two façade collectors for solar thermal energy generation, which permit a high degree of design flexibility: a strip collector for opaque façade sections and a solar thermal blind for transparent sections. The current state of the two developments will be presented at the BAU 2017 trade fair.
As part of the “ArKol – development of architecturally highly integrated façade collectors with heat pipes” project, Fraunhofer ISE together with its partners...
19.01.2017 | Event News
10.01.2017 | Event News
09.01.2017 | Event News
20.01.2017 | Awards Funding
20.01.2017 | Materials Sciences
20.01.2017 | Life Sciences