A new dielectric material, developed by researchers at the University of Illinois at Urbana-Champaign, could facilitate the use of copper circuitry at the chip level. The thermally stable aromatic polymer has a low dielectric constant of 1.85, good mechanical properties and excellent adhesion.
Replacing aluminum with copper as the multilayer interconnect structure in microelectronic devices could enhance both miniaturization and performance. Copper offers much higher electrical and thermal conductivity than aluminum. Placing narrow copper lines close together, however, requires a good dielectric to reduce cross talk between wires. Unfortunately, existing dielectric insulators cant withstand the rigors of the aggressive chemical-mechanical polishing step used to produce a smooth copper surface.
"We developed an aromatic thermosetting polymer for use as an insulating material in copper chip technology," said James Economy, a professor of materials science and engineering at Illinois. "The material has a high thermal stability, low moisture pick-up and can withstand chemical-mechanical polishing."
James E. Kloeppel | EurekAlert!
Physics, photosynthesis and solar cells
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New process produces hydrogen at much lower temperature
01.12.2016 | Waseda University
A multi-institutional research collaboration has created a novel approach for fabricating three-dimensional micro-optics through the shape-defined formation of porous silicon (PSi), with broad impacts in integrated optoelectronics, imaging, and photovoltaics.
Working with colleagues at Stanford and The Dow Chemical Company, researchers at the University of Illinois at Urbana-Champaign fabricated 3-D birefringent...
In experiments with magnetic atoms conducted at extremely low temperatures, scientists have demonstrated a unique phase of matter: The atoms form a new type of quantum liquid or quantum droplet state. These so called quantum droplets may preserve their form in absence of external confinement because of quantum effects. The joint team of experimental physicists from Innsbruck and theoretical physicists from Hannover report on their findings in the journal Physical Review X.
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The Max Planck Institute for Physics (MPP) is opening up a new research field. A workshop from November 21 - 22, 2016 will mark the start of activities for an innovative axion experiment. Axions are still only purely hypothetical particles. Their detection could solve two fundamental problems in particle physics: What dark matter consists of and why it has not yet been possible to directly observe a CP violation for the strong interaction.
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Broadband rotational spectroscopy unravels structural reshaping of isolated molecules in the gas phase to accommodate water
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The efficiency of power electronic systems is not solely dependent on electrical efficiency but also on weight, for example, in mobile systems. When the weight of relevant components and devices in airplanes, for instance, is reduced, fuel savings can be achieved and correspondingly greenhouse gas emissions decreased. New materials and components based on gallium nitride (GaN) can help to reduce weight and increase the efficiency. With these new materials, power electronic switches can be operated at higher switching frequency, resulting in higher power density and lower material costs.
Researchers at the Fraunhofer Institute for Solar Energy Systems ISE together with partners have investigated how these materials can be used to make power...
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