A new dielectric material, developed by researchers at the University of Illinois at Urbana-Champaign, could facilitate the use of copper circuitry at the chip level. The thermally stable aromatic polymer has a low dielectric constant of 1.85, good mechanical properties and excellent adhesion.
Replacing aluminum with copper as the multilayer interconnect structure in microelectronic devices could enhance both miniaturization and performance. Copper offers much higher electrical and thermal conductivity than aluminum. Placing narrow copper lines close together, however, requires a good dielectric to reduce cross talk between wires. Unfortunately, existing dielectric insulators cant withstand the rigors of the aggressive chemical-mechanical polishing step used to produce a smooth copper surface.
"We developed an aromatic thermosetting polymer for use as an insulating material in copper chip technology," said James Economy, a professor of materials science and engineering at Illinois. "The material has a high thermal stability, low moisture pick-up and can withstand chemical-mechanical polishing."
James E. Kloeppel | EurekAlert!
Scientists predict a new superhard material with unique properties
18.06.2018 | Moscow Institute of Physics and Technology
A sprinkle of platinum nanoparticles onto graphene makes brain probes more sensitive
15.06.2018 | University of California - San Diego
Moving into its fourth decade, AchemAsia is setting out for new horizons: The International Expo and Innovation Forum for Sustainable Chemical Production will take place from 21-23 May 2019 in Shanghai, China. With an updated event profile, the eleventh edition focusses on topics that are especially relevant for the Chinese process industry, putting a strong emphasis on sustainability and innovation.
Founded in 1989 as a spin-off of ACHEMA to cater to the needs of China’s then developing industry, AchemAsia has since grown into a platform where the latest...
The BMBF-funded OWICELLS project was successfully completed with a final presentation at the BMW plant in Munich. The presentation demonstrated a Li-Fi communication with a mobile robot, while the robot carried out usual production processes (welding, moving and testing parts) in a 5x5m² production cell. The robust, optical wireless transmission is based on spatial diversity; in other words, data is sent and received simultaneously by several LEDs and several photodiodes. The system can transmit data at more than 100 Mbit/s and five milliseconds latency.
Modern production technologies in the automobile industry must become more flexible in order to fulfil individual customer requirements.
An international team of scientists has discovered a new way to transfer image information through multimodal fibers with almost no distortion - even if the fiber is bent. The results of the study, to which scientist from the Leibniz-Institute of Photonic Technology Jena (Leibniz IPHT) contributed, were published on 6thJune in the highly-cited journal Physical Review Letters.
Endoscopes allow doctors to see into a patient’s body like through a keyhole. Typically, the images are transmitted via a bundle of several hundreds of optical...
Light detection and control lies at the heart of many modern device applications, such as smartphone cameras. Using graphene as a light-sensitive material for...
Water molecules exist in two different forms with almost identical physical properties. For the first time, researchers have succeeded in separating the two forms to show that they can exhibit different chemical reactivities. These results were reported by researchers from the University of Basel and their colleagues in Hamburg in the scientific journal Nature Communications.
From a chemical perspective, water is a molecule in which a single oxygen atom is linked to two hydrogen atoms. It is less well known that water exists in two...
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18.06.2018 | Process Engineering
18.06.2018 | Life Sciences