Automotive manufacturers may soon benefit from a new breed of metals – known as functionally gradient materials – that can withstand the high temperatures of die casting without cracking under pressure, according to a researcher at the University of Missouri-Rolla.
UMR researchers, led by Dr. Frank Liou, director of the manufacturing engineering program and professor of mechanical and aerospace engineering, hope to build better die-casting molds by developing materials that are both durable and heat resistant.
Traditional die-casting molds, made from hardened steel and used to make engine blocks and other components, can cost about $500,000 each, are fairly large and take a long time to build. One of the greatest challenges for car manufacturers has been finding a die-cast metal that can take the heat while maintaining its durability. Now, thanks to Liou’s work, manufacturers are one step closer to having the best of both worlds.
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Reflecting the structure of composites found in nature and the ancient world, researchers at the University of Illinois at Urbana-Champaign have synthesized thin carbon nanotube (CNT) textiles that exhibit both high electrical conductivity and a level of toughness that is about fifty times higher than copper films, currently used in electronics.
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The nearby, giant radio galaxy M87 hosts a supermassive black hole (BH) and is well-known for its bright jet dominating the spectrum over ten orders of magnitude in frequency. Due to its proximity, jet prominence, and the large black hole mass, M87 is the best laboratory for investigating the formation, acceleration, and collimation of relativistic jets. A research team led by Silke Britzen from the Max Planck Institute for Radio Astronomy in Bonn, Germany, has found strong indication for turbulent processes connecting the accretion disk and the jet of that galaxy providing insights into the longstanding problem of the origin of astrophysical jets.
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Microprocessors based on atomically thin materials hold the promise of the evolution of traditional processors as well as new applications in the field of flexible electronics. Now, a TU Wien research team led by Thomas Müller has made a breakthrough in this field as part of an ongoing research project.
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