Rensselaer Researchers Pioneer Interconnect Technology that May Take Chips Into 3-D
Researchers led by Ronald J. Gutmann in the Focus Center-New York at Rensselaer (FC-NY-RPI) are pioneering new interconnect technologies that promise to deliver smaller, faster, inexpensive, microelectronics and circuits that function in three dimensions.
Researchers at Rensselaer’s Focus Center-NY for Interconnections for Gigascale Integration believe that a strategy in which several chip wafers are bonded together in 3-D and interconnected provides an effective means to integrate chip technologies, and will dramatically improve performance and function. Working with collaborators from the semiconductor industry and other universities, the Rensselaer team is developing more effective interconnects that will allow information to get where it’s going more quickly and make computing ever faster.
Ultra-precise chip-scale sensor detects unprecedentedly small changes at the nanoscale
18.01.2017 | The Hebrew University of Jerusalem
Data analysis optimizes cyber-physical systems in telecommunications and building automation
18.01.2017 | Fraunhofer-Institut für Algorithmen und Wissenschaftliches Rechnen SCAI
An important step towards a completely new experimental access to quantum physics has been made at University of Konstanz. The team of scientists headed by...
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Researchers from the University of Hamburg in Germany, in collaboration with colleagues from the University of Aarhus in Denmark, have synthesized a new superconducting material by growing a few layers of an antiferromagnetic transition-metal chalcogenide on a bismuth-based topological insulator, both being non-superconducting materials.
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Studying properties of fundamental particles in condensed matter systems is a promising approach to quantum field theory. Quasiparticles offer the opportunity...
Among the general public, solar thermal energy is currently associated with dark blue, rectangular collectors on building roofs. Technologies are needed for aesthetically high quality architecture which offer the architect more room for manoeuvre when it comes to low- and plus-energy buildings. With the “ArKol” project, researchers at Fraunhofer ISE together with partners are currently developing two façade collectors for solar thermal energy generation, which permit a high degree of design flexibility: a strip collector for opaque façade sections and a solar thermal blind for transparent sections. The current state of the two developments will be presented at the BAU 2017 trade fair.
As part of the “ArKol – development of architecturally highly integrated façade collectors with heat pipes” project, Fraunhofer ISE together with its partners...
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