Technology Offerings

Controlling Ion Energy and Flux in RF Plasma Discharges

The energy of ions impacting surfaces during plasma processing is crucial in determining both

the properties of materials being deposited by plasmas and for the control of the etching of thin films. A new method that allows the ion energy and plasma density to be decoupled has been developed.

Further Information: PDF

rubitec – Gesellschaft für Innovation und Technologie der Ruhr-Universität Bochum mbH
Phone: +49 (0)234/32-11969

Contact
Dietmar Tappe

Comments (0)

Write a comment