Process Engineering
This special field revolves around processes for modifying material properties (milling, cooling), composition (filtration, distillation) and type (oxidation, hydration).
Valuable information is available on a broad range of technologies including material separation, laser processes, measuring techniques and robot engineering in addition to testing methods and coating and materials analysis processes.
3-D ultrasound scanner could guide robotic surgeries
The scanner could find application in various medical settings, according to the researchers. They said the scanner ultimately might enable surgeries to be…
UD scientists use carbon nanotubes to detect defects in composites
The discovery has important implications both in the laboratory, where the scientists hope to better predict the life span of various composite materials, and…
Delft water-purification method promises radical improvement
With the new aerobic granular sludge technology (Nereda TM), aerobic (thus oxygen using) bacterial granules are formed in the water that is to be purified. The…
A new indicator of natural rubber quality
To strengthen the position of natural rubber in relation to its synthetic rival, a CIRAD team has just used an innovative technique to identify a new indicator of the quality of this noble material.
Natural rubber has properties that are still unsurpassed, and many specific uses: aircraft and truck tyres, vehicle engine supports, high-speed train suspension parts, industrial glues and adhesive tapes, elastic yarns, gloves, condoms, etc. However, it is a product of biological ori
A laser technique that strips hydrogen atoms from silicon surfaces enables low-temperature semiconductor processing
A team of researchers has achieved a long-sought scientific goal: using laser light to break specific molecular bonds. The process uses laser light, instead of heat, to strip hydrogen atoms from silicon surfaces. This is a key step in the manufacture of computer chips and solar cells, so the achievement could reduce the cost and improve the quality of a wide variety of semiconductor devices.
The technique was developed by Philip I. Cohen at the University of Minnesota, working with Vanderbi
New laser technique that strips hydrogen from silicon surfaces
Enables lower-temperature semiconductor processing
A team of researchers have achieved a long-sought scientific goal: using laser light to break specific molecular bonds. The process uses laser light, instead of heat, to strip hydrogen atoms from silicon surfaces, a key step in the manufacture of computer chips and solar cells.
The new technique was developed by Philip Cohen, a professor of electrical and computer engineering at the University of Minnesota, working with