Wire Bonding is the most widespread technology for chip interconnects due to its advantages such as flexibility, reliability and competitive speed of the process. It is suitable for a wide range of packaging approaches as for example: lead-frame, ceramic thick film and chip on board, with different metallization on the chip as well as on the carrier/ substrate. The problem with hitherto existing methods to control the wire bonding process is that these do not always yield optimal results and do not work in real-time.
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