At this year's ECOC, the Fraunhofer Heinrich Hertz Institute HHI presents its latest solutions in the area of photonic components and photonic networks and systems.
You find the following highlights at our Booth 350 in Hall 3:
InP Foundry Services – Photonic Integration Toolbox
Fraunhofer HHI enables an own design of InP-based Photonic Integrated Circuit (PIC) containing passive and active devices on one substrate. It is possible to choose from a range of proven building blocks, such as 40 GHz receivers, 20 GHz transmitters, and 1 dB/cm passive waveguides. Low-cost multi-project-wafer-run-based PICs are already commercially available through Jeppix and customer-specific private runs can be realized on demand. Dedicated design and layout software is provided, and several packaging partners are available.
InP Lasers for Integration into Silicon Photonics – Optical Sources for Si-Photonics
Fraunhofer HHI provides DFB lasers, gain chips and SOAs with flip chip capability for hybrid integration on Si-Platforms. Single devices and arrays are offered for lateral and vertical coupling schemes. InGaAsP and InGaAlAs are used as active MQW layer and operating wavelengths range from 1270 nm to 1650 nm.
PolyBoard Foundry Services
The PolyBoard integration platform allows for rapid prototyping, short iteration cycles and low upfront development effort. Fraunhofer HHI's technology allows the integration of on-chip free space elements, 3D structures, graphene electro-absorption modulators, as well as other optical functionalities such as switches, variable optical attenuators, and tunable lasers.
LED based Optical Wireless Backhaul Link
The robust, low latency infrared LED link is well suited for mobile backhaul. The technology is also well suited for wireless point-to-point communication in industrial environments.
Optical Wireless Links for industrial M2M applications
The robust, mobile data links based on illumination LEDs are insensitive to EM-interference and well-suited for wireless, secure communication in industrial environments.
Real-time Digital Signal Processing Platform for Terabit Transmission
The Fraunhofer HHI presents innovative solutions for real-time signal processing in optical terabit-class transmission systems. This includes a compact coherent optical receiver (> 70 GHz bandwidth) and a sophisticated processing platform based on 56 GSa/s ADCs and Xilinx Ultrascale® FPGAs. In addition, Fraunhofer HHI portfolio provides a variety of high-performance software algorithms for real-time signal processing and for digital non-linear pre-distortion.
Anne Rommel | Fraunhofer-Institut für Nachrichtentechnik Heinrich-Hertz-Institut
Development and Fast Analysis of 3D Printed HF Components
19.03.2018 | Fraunhofer-Institut für Hochfrequenzphysik und Radartechnik FHR
Photovoltaics: easy implementation thanks to modern printing techniques
14.03.2018 | Fraunhofer-Institut für Angewandte Polymerforschung IAP
For the first time, an interdisciplinary team from the University of Basel has succeeded in integrating artificial organelles into the cells of live zebrafish embryos. This innovative approach using artificial organelles as cellular implants offers new potential in treating a range of diseases, as the authors report in an article published in Nature Communications.
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Animal photoreceptors capture light with photopigments. Researchers from the University of Göttingen have now discovered that these photopigments fulfill an...
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At the 2018 ILA Berlin Air Show from April 25–29, the Fraunhofer Institute for Laser Technology ILT is showcasing extreme high-speed Laser Material Deposition (EHLA): A video documents how for metal components that are highly loaded, EHLA has already proved itself as an alternative to hard chrome plating, which is now allowed only under special conditions.
When the EU restricted the use of hexavalent chromium compounds to special applications requiring authorization, the move prompted a rethink in the surface...
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