SPS IPC Drives 2014, Hall 11
The SPS IPC Drives on November 25 in Nuremberg marked the launch of the Siemens IDS Roadshow, which hits the road this winter under the banner of "Extra Value Integrated". From Nuremberg, the truck will be setting out to visit Siemens' industrial customers across much of Europe over the coming months.
With this mobile exhibition, Siemens intends to demonstrate how Integrated Drive Solutions can enhance the efficiency, reliability and productivity of industrial applications and so achieve sustainable competitive advantages. The IDS Roadshow will be focusing on ways in which Integrated Drive Systems can add value for customers.
The truck will be equipped with a full complement of application-specific exhibits and live demos, all of which are designed to illustrate the tangible benefits to be gained from combining ideally matched drive and automation components for use in the most diverse applications and branches of industry.
Before the IDS Truck embarks on its European tour, visitors to the SPS IPC Drives will have the chance to preview the mobile exhibition at the Siemens booth in Hall 11 during the trade fair from 25 – 28 November in Nuremberg. The exhibits on show cover a vast spectrum of technologies, from intralogistics through conveying technology to pump, fan and compressor applications, as well as vertical mills and large-scale medium-voltage applications in the process industry. In each case, the exhibits graphically illustrate the benefits of a systematic three-pronged approach to integration – the core element of IDS. This entails a horizontal process of integration from the gear and coupling through the motor and converter along the energy flow, based on the comprehensive Siemens drive portfolio. The second level takes place vertically within the automation hierarchy through integration into the control architecture of industrial production processes. In this context, the mobile exhibition highlights integration of the drive train and its components into the TIA Portal Engineering Framework, and the potential this opens up for efficient engineering. The third integration level relates to the product life cycle, and involves the complete data technology integration of components into the relevant industrial planning, design and commissioning processes. In this field, the IDS Truck demonstrates how integrated software and comprehensive services can ensure not only faster commissioning and greater reliability, but also reduced maintenance costs.
For an overview of dates and locations visited by the IDS Roadshow, go to www.siemens.de/ids-roadshow
Further press material on the IDS roadshow is available at www.siemens.com/press/ids-roadshow
Siemens AG (Berlin and Munich) is a global technology powerhouse that has stood for engineering excellence, innovation, quality, reliability and internationality for more than 165 years. The company is active in more than 200 countries, focusing on the areas of electrification, automation and digitalization. One of the world's largest producers of energy-efficient, resource-saving technologies, Siemens is No. 1 in offshore wind turbine construction, a leading supplier of combined cycle turbines for power generation, a major provider of power transmission solutions and a pioneer in infrastructure solutions as well as automation, drive and software solutions for industry. The company is also a leading provider of medical imaging equipment – such as computed tomography and magnetic resonance imaging systems – and a leader in laboratory diagnostics as well as clinical IT. In fiscal 2014, which ended on September 30, 2014, Siemens generated revenue from continuing operations of €71.9 billion and net income of €5.5 billion. At the end of September 2014, the company had around 357,000 employees worldwide.
Further information is available on the Internet at www.siemens.com
Reference Number: PR2014110052PDEN
Mr. Stefan Rauscher
Process Industries and Drives Division
Gleiwitzer Str. 555
Tel: +49 (911) 895-7952
Stefan Rauscher | Siemens Process Industries and Drives
Creating living spaces for people: The »Fraunhofer CityLaboratory« at BAU 2017
14.10.2016 | Fraunhofer-Gesellschaft
Reducing Weight through Laser-assisted Material Processing in Automobile Construction
13.10.2016 | Fraunhofer-Institut für Lasertechnik ILT
Researchers from the Institute for Quantum Computing (IQC) at the University of Waterloo led the development of a new extensible wiring technique capable of controlling superconducting quantum bits, representing a significant step towards to the realization of a scalable quantum computer.
"The quantum socket is a wiring method that uses three-dimensional wires based on spring-loaded pins to address individual qubits," said Jeremy Béjanin, a PhD...
In a paper in Scientific Reports, a research team at Worcester Polytechnic Institute describes a novel light-activated phenomenon that could become the basis for applications as diverse as microscopic robotic grippers and more efficient solar cells.
A research team at Worcester Polytechnic Institute (WPI) has developed a revolutionary, light-activated semiconductor nanocomposite material that can be used...
By forcefully embedding two silicon atoms in a diamond matrix, Sandia researchers have demonstrated for the first time on a single chip all the components needed to create a quantum bridge to link quantum computers together.
"People have already built small quantum computers," says Sandia researcher Ryan Camacho. "Maybe the first useful one won't be a single giant quantum computer...
COMPAMED has become the leading international marketplace for suppliers of medical manufacturing. The trade fair, which takes place every November and is co-located to MEDICA in Dusseldorf, has been steadily growing over the past years and shows that medical technology remains a rapidly growing market.
In 2016, the joint pavilion by the IVAM Microtechnology Network, the Product Market “High-tech for Medical Devices”, will be located in Hall 8a again and will...
'Ferroelectric' materials can switch between different states of electrical polarization in response to an external electric field. This flexibility means they show promise for many applications, for example in electronic devices and computer memory. Current ferroelectric materials are highly valued for their thermal and chemical stability and rapid electro-mechanical responses, but creating a material that is scalable down to the tiny sizes needed for technologies like silicon-based semiconductors (Si-based CMOS) has proven challenging.
Now, Hiroshi Funakubo and co-workers at the Tokyo Institute of Technology, in collaboration with researchers across Japan, have conducted experiments to...
14.10.2016 | Event News
14.10.2016 | Event News
12.10.2016 | Event News
24.10.2016 | Health and Medicine
24.10.2016 | Life Sciences
24.10.2016 | Life Sciences