Forum for Science, Industry and Business

Sponsored by:     3M 
Search our Site:


Gluing with the Laser


Natural stone like marble or granite are processed with saw blades with hard-wearing, diamond cutting segments. When these are damaged or worn, the cutting segments have to be replaced. Usually, the whole saw blade is then sent to a repair shop. 

The Laser Zentrum Hannover e.V. (LZH) and the Institut für Werkzeugforschung und Werkstoffe (IFW) in Remscheid have now developed a mobile, laser-based process chain for gluing the cutting segments onto the saw blade and removing them subsequently without causing damage.

The innovative laser based gluing process could, in the future, replace soldering for refitting saw blades.

Photo: LZH

Concept of the process for laser gluing. (1) Removal of the worn cutting segment, (2) Cleaning of glue residues from the surface, (3) Surface preparation, (4) Hardening of the glue.

Figure: LZH

Up to now, the soldered cutting segments are thermally detached, the soldering partners prepared, and the new cutting segments are then soldered onto the saw blade.

The thermal stress from soldering leads to axial runout deviations (warpage) and an unfavorable distribution of stress in the saw blade. Consequently, the cutting quality decreases, and cutting losses increase. Therefore, additional process steps are necessary to align and preload the saw blades.

Laser for all the process steps

Based on laser and gluing technology, a laser-based process chain for manufacturing glued saw blades was developed at the LZH and IFW. The laser radiation only exerts minimal thermal stress onto the saw blades, so that in the best case, the blades can be refitted without preloading or alignment. Ideally, the saw blade can be refitted as often as necessary.

The laser-based process for the first and consequent fittings of the saw blade consists of four steps: First, the surfaces of the segments and the saw blade are prepared by structuring them using a pulsed laser system. The segments are then glued onto the saw blade using a one-component epoxy resin adhesive, which is thermally hardened using a continuous wave (cw) laser system.

When the life span of the segments has been reached, they are detached from the saw blade using the cw laser system. A pulsed laser system is then used to remove glue residues and impurities from the gluing partners. Following this, the saw blade can be refitted.

Refitting on the spot

For demonstration purposes, the LZH has developed a mobile unit, with which refitting can be carried out directly at the user’s premises. Such a refitted saw blade has already been used to successfully cut granite.

Advantages of Gluing

In comparison to soldering, gluing has many advantages. Among these are a very low, respectively no thermal distortion, no heat tinting, a homogeneous distribution of stress in the joining zone, and a relatively high joining strength and high vibration dampening.

The IGF project under the number 17120 N of the Forschungsvereinigung Forschungsgemeinschaft Werkzeuge und Werkstoffe e.V. (FGW) [Research Association for Tools and Materials] has been funded within the framework of the program for supporting industrial research of the German Federal Ministry for Economic Affairs and Energy (BMWi), based on a decision of the German Parliament.

A short summary of the research results can be downloaded on the website of the FGW Remscheid or the LZH (only available in German).

The final report can be ordered from the Forschungsgemeinschaft Werkzeuge und Werkstoffe e.V., Papenberger Str. 49, 42859 Remscheid.

Weitere Informationen: - website of the press release with more pictures, videos and a download link for the summary of the report.

Lena Bennefeld | Laser Zentrum Hannover e.V.

More articles from Process Engineering:

nachricht Etching Microstructures with Lasers
25.10.2016 | Fraunhofer-Institut für Lasertechnik ILT

nachricht Applying electron beams to 3-D objects
23.09.2016 | Fraunhofer-Institut für Organische Elektronik, Elektronenstrahl- und Plasmatechnik FEP

All articles from Process Engineering >>>

The most recent press releases about innovation >>>

Die letzten 5 Focus-News des innovations-reports im Überblick:

Im Focus: Novel light sources made of 2D materials

Physicists from the University of Würzburg have designed a light source that emits photon pairs. Two-photon sources are particularly well suited for tap-proof data encryption. The experiment's key ingredients: a semiconductor crystal and some sticky tape.

So-called monolayers are at the heart of the research activities. These "super materials" (as the prestigious science magazine "Nature" puts it) have been...

Im Focus: Etching Microstructures with Lasers

Ultrafast lasers have introduced new possibilities in engraving ultrafine structures, and scientists are now also investigating how to use them to etch microstructures into thin glass. There are possible applications in analytics (lab on a chip) and especially in electronics and the consumer sector, where great interest has been shown.

This new method was born of a surprising phenomenon: irradiating glass in a particular way with an ultrafast laser has the effect of making the glass up to a...

Im Focus: Light-driven atomic rotations excite magnetic waves

Terahertz excitation of selected crystal vibrations leads to an effective magnetic field that drives coherent spin motion

Controlling functional properties by light is one of the grand goals in modern condensed matter physics and materials science. A new study now demonstrates how...

Im Focus: New 3-D wiring technique brings scalable quantum computers closer to reality

Researchers from the Institute for Quantum Computing (IQC) at the University of Waterloo led the development of a new extensible wiring technique capable of controlling superconducting quantum bits, representing a significant step towards to the realization of a scalable quantum computer.

"The quantum socket is a wiring method that uses three-dimensional wires based on spring-loaded pins to address individual qubits," said Jeremy Béjanin, a PhD...

Im Focus: Scientists develop a semiconductor nanocomposite material that moves in response to light

In a paper in Scientific Reports, a research team at Worcester Polytechnic Institute describes a novel light-activated phenomenon that could become the basis for applications as diverse as microscopic robotic grippers and more efficient solar cells.

A research team at Worcester Polytechnic Institute (WPI) has developed a revolutionary, light-activated semiconductor nanocomposite material that can be used...

All Focus news of the innovation-report >>>



Event News

#IC2S2: When Social Science meets Computer Science - GESIS will host the IC2S2 conference 2017

14.10.2016 | Event News

Agricultural Trade Developments and Potentials in Central Asia and the South Caucasus

14.10.2016 | Event News

World Health Summit – Day Three: A Call to Action

12.10.2016 | Event News

Latest News

Prototype device for measuring graphene-based electromagnetic radiation created

28.10.2016 | Power and Electrical Engineering

Gamma ray camera offers new view on ultra-high energy electrons in plasma

28.10.2016 | Physics and Astronomy

When fat cells change their colour

28.10.2016 | Life Sciences

More VideoLinks >>>