LPACS® – A metalorganic package system for modular microsystem components

The licensing offer regards the conception and creation of a construction kit for modular microsystem components building on the Match-X concept developed by the VDMA (the German Engineering Federation) and the Fraunhofer Institutes IPA and IZM.

Further Information: PDF

PVA Mecklenburg-Vorpommern AG
Phone: +49 (0)381/49 74 74 0

Contact
Antonio Martinez

Media Contact

info@technologieallianz.de TechnologieAllianz e.V.

All latest news from the category: Technology Offerings

Back to home

Comments (0)

Write a comment

Newest articles

Future AR/VR controllers could be the palm of your hand

Carnegie Mellon University’s EgoTouch creates simple interfaces for virtual and augmented reality. The new generation of augmented and virtual reality controllers may not just fit in the palm of your…

‘Game changer’ in lithium extraction

Rice researchers develop novel electrochemical reactor. A team of Rice University researchers led by Lisa Biswal and Haotian Wang has developed an innovative electrochemical reactor to extract lithium from natural…

The blue-green sustainable proteins of seaweed

… may soon be on your plate. The protein in sea lettuce, a type of seaweed, is a promising complement to both meat and other current alternative protein sources. Seaweed…