Method and Device for Controlling the Generation of Ultrasonic
Wire Bonding is the most widespread technology for chip interconnects due to its advantages such as flexibility, reliability and competitive speed of the process. It is suitable for a wide range of packaging approaches as for example: lead-frame, ceramic thick film and chip on board, with different metallization on the chip as well as on the carrier/ substrate. The problem with hitherto existing methods to control the wire bonding process is that these do not always yield optimal results and do not work in real-time.
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