Highly conductive pastes for printable electronic applications and devices

At the Karlsruhe Institute of Technology (KIT), a new platform concept for the formulation of highly conductive, printable pastes has been developed. Corresponding pastes are free of polymeric or other non-volatile stabilizers and rheology control agents. Nevertheless, rheological properties like low-shear viscosity and yield stress can be adjusted in a wide range. Thus sedimentation /aggregation is prohibited and long-term stability can be guaranteed even for suspensions of high density particles (e.g. Ag, Ni). Also full control of the application behavior in many different printing/coating operations is furnished.

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Technologie-Lizenz-Büro (TLB) der Baden-Württembergischen Hochschulen GmbH
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Dipl.-Biol. Marcus Lehnen, MBA

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