The technology will be ready for production in the second half of 2008 or earlier and will, among other things, utilize low-K inter-metal dielectric and the 193-nm patterning process. The smaller geometries will allow for smaller die sizes and faster transistors, bringing a better price-performance profile to Silterra’s customers. A team of Silterra and IMEC engineers will fine-tune the base-IMEC process at IMEC’s research facility in Leuven to meet the specifications defined by Silterra. The process will have physical design rules and electrical characteristics that match mainstream technologies, enabling customers to seamlessly support their multi-foundry sourcing strategy.
“Silterra is committed to the pure foundry business and more advanced process technology development is essential to support the success of our customers. Many of our major customers adopted the multi-foundry strategy and we will continue to grow with them. This project paves the way towards future technology nodes and a migration path to 300mm,” said Kah-Yee Eg, CEO of Silterra. “As proven in our earlier engagement with IMEC, this JDP will enable Silterra to bring a new process into production quickly.”
“We are very pleased that we will continue the successful collaboration with Silterra to develop a foundry process that will benefit such a wide customer base,” stated Prof. Gilbert Declerck, president and CEO of IMEC. “Our 90-nm platform technology is a great starting point to build on because it is proven and will help shorten development cycle times significantly.”
The new process, like Silterra’s own foundry compatible 0.13- and 0.18-micron logic technologies, is targeted for a wide range of products for consumer, communications and computational applications. In addition, the technology is also optimized for CPU, DSP and graphics applications. This jointly developed foundry process opens the door for Silterra to collaborate with other foundry players in rapidly bringing advanced node densities to production.
“We see significant business growth in the next 2-3 years and will continue to actively invest in process technology,” said Eg. “We had built up strong in-house capabilities in developing process technologies for specific applications such as RF, High Voltage and Low Power in 0.18-micron for the past few years and we are currently developing these application specific process technologies on 0.13-micron. We will continue to move these technologies down to 90-nm and 65-nm with our customers. Our aim is to offer the best total solution to our customers – and the availability of technologies for the right process node is critical to that goal.”
Drones shown to make traffic crash site assessments safer, faster and more accurate
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Next generation photonic memory devices are light-written, ultrafast and energy efficient
15.01.2019 | Eindhoven University of Technology
The scientific and political community alike stress the importance of German Antarctic research
Joint Press Release from the BMBF and AWI
The Antarctic is a frigid continent south of the Antarctic Circle, where researchers are the only inhabitants. Despite the hostile conditions, here the Alfred...
World first experiments on sensor that may revolutionise everything from medical devices to unmanned vehicles
The new sensor - capable of detecting vibrations of living cells - may revolutionise everything from medical devices to unmanned vehicles.
Dead and alive at the same time? Researchers at the Max Planck Institute of Quantum Optics have implemented Erwin Schrödinger’s paradoxical gedanken experiment employing an entangled atom-light state.
In 1935 Erwin Schrödinger formulated a thought experiment designed to capture the paradoxical nature of quantum physics. The crucial element of this gedanken...
Cellulose obtained from wood has amazing material properties. Empa researchers are now equipping the biodegradable material with additional functionalities to produce implants for cartilage diseases using 3D printing.
It all starts with an ear. Empa researcher Michael Hausmann removes the object shaped like a human ear from the 3D printer and explains:
The phenomenon of so-called superlubricity is known, but so far the explanation at the atomic level has been missing: for example, how does extremely low friction occur in bearings? Researchers from the Fraunhofer Institutes IWM and IWS jointly deciphered a universal mechanism of superlubricity for certain diamond-like carbon layers in combination with organic lubricants. Based on this knowledge, it is now possible to formulate design rules for supra lubricating layer-lubricant combinations. The results are presented in an article in Nature Communications, volume 10.
One of the most important prerequisites for sustainable and environmentally friendly mobility is minimizing friction. Research and industry have been dedicated...
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