IBM and TotalStorage®-based Systems Improve Patient Care and Efficiency for Customers Worldwide, Including Brno University Hospital and St Michael’s Hospital
White Plains, NY and Erlangen, Germany, July 29, 2004 -- IBM and Siemens AG (XETRA: SIE) today announced that they have signed a global agreement to deliver medical imaging management systems for the healthcare industry.
The IBM-Siemens relationship addresses management of the rapidly growing volume of digital medical images produced by radiological examinations around the world. Medical imaging management systems provide hospitals and clinics with a cost-effective method to manage this data and improve patient care by making important medical information available whenever and wherever it is needed, to support diagnosis and treatment. SIENET®, the integrated radiology suite - the fully integrated RIS/PACS* System from Siemens Medical Solutions, in conjunction with IBM and IBM TotalStorage® technology are currently used by some of the world’s most advanced medical centers and hospitals. Two of the most recent customers to benefit from the IBM-Siemens solution are Brno University Hospital in the Czech Republic and St Michael’s hospital in Toronto, Canada.
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Researchers at Chalmers University of Technology, Sweden, have discovered a completely new way of capturing, amplifying and linking light to matter at the nanolevel. Using a tiny box, built from stacked atomically thin material, they have succeeded in creating a type of feedback loop in which light and matter become one. The discovery, which was recently published in Nature Nanotechnology, opens up new possibilities in the world of nanophotonics.
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Fraunhofer IZM is joining the EUROPRACTICE IC Service platform. Together, the partners are making fan-out wafer level packaging (FOWLP) for electronic devices available and affordable even in small batches – and thus of interest to research institutes, universities, and SMEs. Costs can be significantly reduced by up to ten customers implementing individual fan-out wafer level packaging for their ICs or other components on a multi-project wafer. The target group includes any organization that does not produce in large quantities, but requires prototypes.
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