Forum for Science, Industry and Business

Sponsored by:     3M 
Search our Site:

 

Computer chips: Building upward safely

28.03.2013
A computer model provides important clues for the production of tightly packed electronic components

Greater numbers of ever-smaller components are required to fit on computer chips to meet the ongoing demands of miniaturizing electronic devices. Consequently, computer chips are becoming increasingly crowded.

Designers of electronic architectures have therefore followed the lead of urban planners and started to build upward. In so-called ‘three-dimensional (3D) packages’, for example, several flat, two-dimensional chips can be stacked on top of each other using vertical joints.

Controlling the properties of these complex structures is no easy task, as many factors come into play during production. Faxing Che and Hongyu Li and co-workers from the A*STAR Institute of Microelectronics, Singapore, have now developed a powerful modeling method that allows large-scale simulations — and optimization — of the fabrication process, which provides welcome assistance to designers.

Among the challenges of producing tightly packed computer chips is the need to prevent warpage of the underlying silicon wafer as electronics components are stacked on it. Warpage leads to a number of unwanted effects. “Strong warpage can cause wafer breakage, it makes tight packing more difficult and some processing machines cannot handle high-warpage wafers,” explains Li. The degree of warpage depends on many design and process parameters, and optimizing the procedure experimentally is time-consuming and costly.

Using their computer model, Che and Li studied a wide range of parameters that influence the warpage of an 8-inch diameter silicon wafer. They focused, in particular, on how a silicon substrate responds to the deposition of layers of copper — through which electrical currents eventually flow. “This is the first time that a model has been able to predict warpage [at] the level of the entire wafer,” says Li. Moreover, the stress on the wafer can be determined accurately. The calculated values agreed well with experimental data. Importantly, with the computer simulations, the researchers could explore regimes that cannot be easily studied experimentally, such as how the depth of the connections between layers influences wafer warpage.

The next goal is to simulate even larger wafers with variable connection sizes, explains Li. “Today, there are two industry standards for 3D packaging applications, 8-inch and 12-inch wafers, but the latter are becoming increasingly important,” she says. The team’s model is applicable to these larger wafers, too, but it requires optimization. Currently, Che, Li and their co-workers are collecting warpage and stress data for 12-inch wafers. They will use these data for developing their model further, according to Li.

The A*STAR-affiliated researchers contributing to this research are from the Institute of Microelectronics

Journal information

Che, F.-X. X., Li, H. Y., Zhang, X. W., Gao, S. & Teo, K. H. Development of wafer-level warpage and stress modeling methodology and its application in process optimization for TSV wafers. IEEE Transactions on Components, Packaging and Manufacturing Technology 2, 944–955 (2012)

A*STAR Research | Research asia research news
Further information:
http://www.research.a-star.edu.sg
http://www.researchsea.com

More articles from Information Technology:

nachricht Reversing cause and effect is no trouble for quantum computers
20.07.2018 | Centre for Quantum Technologies at the National University of Singapore

nachricht Study suggests buried Internet infrastructure at risk as sea levels rise
18.07.2018 | University of Wisconsin-Madison

All articles from Information Technology >>>

The most recent press releases about innovation >>>

Die letzten 5 Focus-News des innovations-reports im Überblick:

Im Focus: Future electronic components to be printed like newspapers

A new manufacturing technique uses a process similar to newspaper printing to form smoother and more flexible metals for making ultrafast electronic devices.

The low-cost process, developed by Purdue University researchers, combines tools already used in industry for manufacturing metals on a large scale, but uses...

Im Focus: First evidence on the source of extragalactic particles

For the first time ever, scientists have determined the cosmic origin of highest-energy neutrinos. A research group led by IceCube scientist Elisa Resconi, spokesperson of the Collaborative Research Center SFB1258 at the Technical University of Munich (TUM), provides an important piece of evidence that the particles detected by the IceCube neutrino telescope at the South Pole originate from a galaxy four billion light-years away from Earth.

To rule out other origins with certainty, the team led by neutrino physicist Elisa Resconi from the Technical University of Munich and multi-wavelength...

Im Focus: Magnetic vortices: Two independent magnetic skyrmion phases discovered in a single material

For the first time a team of researchers have discovered two different phases of magnetic skyrmions in a single material. Physicists of the Technical Universities of Munich and Dresden and the University of Cologne can now better study and understand the properties of these magnetic structures, which are important for both basic research and applications.

Whirlpools are an everyday experience in a bath tub: When the water is drained a circular vortex is formed. Typically, such whirls are rather stable. Similar...

Im Focus: Breaking the bond: To take part or not?

Physicists working with Roland Wester at the University of Innsbruck have investigated if and how chemical reactions can be influenced by targeted vibrational excitation of the reactants. They were able to demonstrate that excitation with a laser beam does not affect the efficiency of a chemical exchange reaction and that the excited molecular group acts only as a spectator in the reaction.

A frequently used reaction in organic chemistry is nucleophilic substitution. It plays, for example, an important role in in the synthesis of new chemical...

Im Focus: New 2D Spectroscopy Methods

Optical spectroscopy allows investigating the energy structure and dynamic properties of complex quantum systems. Researchers from the University of Würzburg present two new approaches of coherent two-dimensional spectroscopy.

"Put an excitation into the system and observe how it evolves." According to physicist Professor Tobias Brixner, this is the credo of optical spectroscopy....

All Focus news of the innovation-report >>>

Anzeige

Anzeige

VideoLinks
Industry & Economy
Event News

Leading experts in Diabetes, Metabolism and Biomedical Engineering discuss Precision Medicine

13.07.2018 | Event News

Conference on Laser Polishing – LaP: Fine Tuning for Surfaces

12.07.2018 | Event News

11th European Wood-based Panel Symposium 2018: Meeting point for the wood-based materials industry

03.07.2018 | Event News

 
Latest News

A smart safe rechargeable zinc ion battery based on sol-gel transition electrolytes

20.07.2018 | Power and Electrical Engineering

Reversing cause and effect is no trouble for quantum computers

20.07.2018 | Information Technology

Princeton-UPenn research team finds physics treasure hidden in a wallpaper pattern

20.07.2018 | Materials Sciences

VideoLinks
Science & Research
Overview of more VideoLinks >>>