The new microme|x from phoenix|x-ray
On the occasion of Productronica 2005 phoenix|x-ray will be presenting a world premiere the new highly resolving X-ray inspections system microme|x.
A novelty to the industry phoenix|x-ray has developed a system that combines all features for an optimum comprehensive inspection of printed circuit board assemblies. The microme|x disposes of an extra large scanning area of 20" x 24", a highly precise manipulation unit with 360° rotation axis and the approved ovhm technology for oblique views up to 70° at constant magnification. The special value is the combination of these characteristics - for the first time the operator can now inspect large boards with mixed assemblies and acquire real-time oblique views under all angles (0-360°). A typical inspection task could be the analysis of the solder joint pad wetting quality of a centrally placed BGA.
Another outstanding characteristic of the microme|x is the board handling unit connection for fully automated loading of assembled boards in the production plant. In connection with the new inspection software XE² it is thus possible to perform a fully automated inspection and evaluation of BGA, CGA, QFP, THT and other solder joints. In this way multiple inspection tasks can be executed and repeated in an easy, reliable und time-saving manner. An interface for the CAD-data import allows using the original PCB layout in order to teach in the inspection routine. The inspection reports can be transferred to a rework station by means of the repair programme quality|review and thus badly soldered devices can easily be found and replaced or reworked. The SPC* module (*Statistical Process Control) allows the statistical evaluation of the inspection results and the process supervision.
Ilka Doering | phoenix x-ray Systems + Services
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