A new dielectric material, developed by researchers at the University of Illinois at Urbana-Champaign, could facilitate the use of copper circuitry at the chip level. The thermally stable aromatic polymer has a low dielectric constant of 1.85, good mechanical properties and excellent adhesion.
Replacing aluminum with copper as the multilayer interconnect structure in microelectronic devices could enhance both miniaturization and performance. Copper offers much higher electrical and thermal conductivity than aluminum. Placing narrow copper lines close together, however, requires a good dielectric to reduce cross talk between wires. Unfortunately, existing dielectric insulators cant withstand the rigors of the aggressive chemical-mechanical polishing step used to produce a smooth copper surface.
"We developed an aromatic thermosetting polymer for use as an insulating material in copper chip technology," said James Economy, a professor of materials science and engineering at Illinois. "The material has a high thermal stability, low moisture pick-up and can withstand chemical-mechanical polishing."
James E. Kloeppel | EurekAlert!
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There are currently great hopes for solid-state batteries. They contain no liquid parts that could leak or catch fire. For this reason, they do not require cooling and are considered to be much safer, more reliable, and longer lasting than traditional lithium-ion batteries. Jülich scientists have now introduced a new concept that allows currents up to ten times greater during charging and discharging than previously described in the literature. The improvement was achieved by a “clever” choice of materials with a focus on consistently good compatibility. All components were made from phosphate compounds, which are well matched both chemically and mechanically.
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20.08.2018 | Information Technology