Forum for Science, Industry and Business

Sponsored by:     3M 
Search our Site:

 

Improved dielectric developed for chip-level copper circuitry

30.03.2005


A new dielectric material, developed by researchers at the University of Illinois at Urbana-Champaign, could facilitate the use of copper circuitry at the chip level. The thermally stable aromatic polymer has a low dielectric constant of 1.85, good mechanical properties and excellent adhesion.



Replacing aluminum with copper as the multilayer interconnect structure in microelectronic devices could enhance both miniaturization and performance. Copper offers much higher electrical and thermal conductivity than aluminum. Placing narrow copper lines close together, however, requires a good dielectric to reduce cross talk between wires. Unfortunately, existing dielectric insulators can’t withstand the rigors of the aggressive chemical-mechanical polishing step used to produce a smooth copper surface.

"We developed an aromatic thermosetting polymer for use as an insulating material in copper chip technology," said James Economy, a professor of materials science and engineering at Illinois. "The material has a high thermal stability, low moisture pick-up and can withstand chemical-mechanical polishing."


The material that Economy and former graduate student Youngqing Huang (now at DuPont) started with had a dielectric constant of 2.7. By adding porogens -- materials that leave tiny holes when they evaporate -- the researchers lowered the dielectric constant to 1.85, while maintaining an acceptably high level of hardness and stiffness.

"The pores are closed and about 5 nanometers in size," Economy said. "They are formed when heat is applied to low molecular weight porogens dispersed through the film. The porogens break down into small gas molecules that can diffuse through the polymer structure. The resulting microporosity does not significantly reduce the mechanical integrity of the foamed material."

The new dielectric can withstand temperatures up to 400 degrees Celsius, is easily applied in solution phase to form a submicron thin film, and adheres to substrates better than other candidate materials.

"We feel we have identified the critical problems confronting the development of a dielectric material to facilitate the use of copper chip interconnections," Economy said, "and we have solved every one of them."

Huang will describe the new material at the spring meeting of the Materials Research Society, to be held in San Francisco, March 28 through April 1. The researchers have applied for a patent.

James E. Kloeppel | EurekAlert!
Further information:
http://www.uiuc.edu

More articles from Materials Sciences:

nachricht Novel sensors could enable smarter textiles
17.08.2018 | University of Delaware

nachricht Quantum material is promising 'ion conductor' for research, new technologies
17.08.2018 | Purdue University

All articles from Materials Sciences >>>

The most recent press releases about innovation >>>

Die letzten 5 Focus-News des innovations-reports im Überblick:

Im Focus: It’s All in the Mix: Jülich Researchers are Developing Fast-Charging Solid-State Batteries

There are currently great hopes for solid-state batteries. They contain no liquid parts that could leak or catch fire. For this reason, they do not require cooling and are considered to be much safer, more reliable, and longer lasting than traditional lithium-ion batteries. Jülich scientists have now introduced a new concept that allows currents up to ten times greater during charging and discharging than previously described in the literature. The improvement was achieved by a “clever” choice of materials with a focus on consistently good compatibility. All components were made from phosphate compounds, which are well matched both chemically and mechanically.

The low current is considered one of the biggest hurdles in the development of solid-state batteries. It is the reason why the batteries take a relatively long...

Im Focus: Color effects from transparent 3D-printed nanostructures

New design tool automatically creates nanostructure 3D-print templates for user-given colors
Scientists present work at prestigious SIGGRAPH conference

Most of the objects we see are colored by pigments, but using pigments has disadvantages: such colors can fade, industrial pigments are often toxic, and...

Im Focus: Unraveling the nature of 'whistlers' from space in the lab

A new study sheds light on how ultralow frequency radio waves and plasmas interact

Scientists at the University of California, Los Angeles present new research on a curious cosmic phenomenon known as "whistlers" -- very low frequency packets...

Im Focus: New interactive machine learning tool makes car designs more aerodynamic

Scientists develop first tool to use machine learning methods to compute flow around interactively designable 3D objects. Tool will be presented at this year’s prestigious SIGGRAPH conference.

When engineers or designers want to test the aerodynamic properties of the newly designed shape of a car, airplane, or other object, they would normally model...

Im Focus: Robots as 'pump attendants': TU Graz develops robot-controlled rapid charging system for e-vehicles

Researchers from TU Graz and their industry partners have unveiled a world first: the prototype of a robot-controlled, high-speed combined charging system (CCS) for electric vehicles that enables series charging of cars in various parking positions.

Global demand for electric vehicles is forecast to rise sharply: by 2025, the number of new vehicle registrations is expected to reach 25 million per year....

All Focus news of the innovation-report >>>

Anzeige

Anzeige

VideoLinks
Industry & Economy
Event News

LaserForum 2018 deals with 3D production of components

17.08.2018 | Event News

Within reach of the Universe

08.08.2018 | Event News

A journey through the history of microscopy – new exhibition opens at the MDC

27.07.2018 | Event News

 
Latest News

Quantum bugs, meet your new swatter

20.08.2018 | Information Technology

A novel synthetic antibody enables conditional “protein knockdown” in vertebrates

20.08.2018 | Life Sciences

Metamolds: Molding a mold

20.08.2018 | Information Technology

VideoLinks
Science & Research
Overview of more VideoLinks >>>