More than 16.000 people from all over the world visited the halls 8a and 8b to find out about new products and latest trends of the suppliers market.
The joint pavilion of the IVAM Microtechnology Network in hall 8a was more extensive than ever before: 40 exhibitors from seven nations presented recent trends in development and manufacturing of medical devices and components at the Product Market "High-tech for Medical Devices".
The exhibitors of the joint pavilion showed, for example, microfluidic solutions and components for lap-on-a-chip applications, metrology for applications like tribological analysis or healthcare imaging as well as micro sensors for improved patient care. Furthermore, highly precise microstructures and -components, made of different materials like glass, plastics or metal were showcased.
These components and structures – it is possible for instance to manufacture a metal tube with an outer diameter of 0.1mm - enable a more cost-effective production of medical devices and consumer goods.
“The exhibitors of our pavilion are more than satisfied with the number of visitors and with the quality of their leads at this trade fair“, reports IVAM trade fair manager Orkide Karasu. “This high degree of satisfaction is reflected by numerous bookings for the upcoming year.
At the fair already ten companies, more than ever before, decided to exhibit again with IVAM in 2013. We have already filled a third of the whole Product Market. We expect that the joint pavilion will be sold out in January – just like it was the year before.”
At the COMPAMED HIGH-TECH forum, which was organized by the IVAM Microtechnology Network too, international experts from science and industry presented current trends of the suppliers’ industry and gave an outlook on future developments. Main topics were micro precision, quality assurance, electronic manufacturing services as well as laser and photonic applications.
The audience was particularly interested in the session "Miniaturized Electronics for Medical Products", which took place as a workshop and was presented and co-organized by the Fraunhofer Institute for Reliability and Microintegration IZM from Berlin.
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