Forum for Science, Industry and Business

Sponsored by:     3M 
Search our Site:


Success story in Knowledge and Technology Transfer at the University of Stuttgart


Logistic invention leads to innovative and excellent product solution

At Europe’s largest trade fair for intralogistics LogiMAT, taking place from 25th until 27th February 2014 in Stuttgart, the double-skid system produced by Eisenmann (Böblingen) was awarded the “best product” in the category “procuring, conveying, storing“.

double-skid system independently

Universität Stuttgart

The University of Stuttgart also had cause for celebration: this autonomous transport unit was developed at the Institute of Conveying Technologies and Logistics (IFT) under the management of Prof. Karl-Heinz Wehking and registered for patent approval in cooperation with the Technology Licencing Bureau (TLB) of Baden-Württemberg’ Hochschulen GmbH (Karlsruhe).

In many business fields small autonomous machines are replacing an increasing number of large and centrally controlled systems. A prime example of this development is the invention of the double-skid system in the field of intralogistics. This is a small self-propelled lift truck, able to lift and transport pallets and other charge carriers.

The double-skid system independently drives under pallets. With a dead weight of less than 100 kilograms, the means of transport stems loads up to one ton via rotation movements of its four drive units.

Head of the IFT Institute Prof. Karl-Heinz Wehking: “The driverless double-skid system revolutionises the operational sequences in transport and warehouse logistics. The fields of application are diverse and the investment and maintenance costs comparatively low.“

Prof. Thomas Graf, Pro-Rector Knowledge and Technology Transfer, underlined the significance of transfer activities for the University of Stuttgart and described the licencing of the double-skid system as one of the greatest and financially most successful licence sales to date:

“In July 2013 the University of Stuttgart and Eisenmann concluded a licencing and development agreement. We are delighted with the award from the LogiMAT trade fair since the double-skid system is a prime example for us of the successful cooperation between the University of Stuttgart and partners from industry and business.“

Further information:
Dr. Hans-Herwig Geyer, Head of University Communication and Press Spokesperson,

University of Stuttgart,
Tel.: 0711/685-82555, Email: hans-herwig.geyer [at]

Andrea Mayer-Grenu | idw - Informationsdienst Wissenschaft
Further information:

Further reports about: LogiMAT Logistic Invention TLB Technology Transfer technology transfer

More articles from Trade Fair News:

nachricht Creating living spaces for people: The »Fraunhofer CityLaboratory« at BAU 2017
14.10.2016 | Fraunhofer-Gesellschaft

nachricht Reducing Weight through Laser-assisted Material Processing in Automobile Construction
13.10.2016 | Fraunhofer-Institut für Lasertechnik ILT

All articles from Trade Fair News >>>

The most recent press releases about innovation >>>

Die letzten 5 Focus-News des innovations-reports im Überblick:

Im Focus: Etching Microstructures with Lasers

Ultrafast lasers have introduced new possibilities in engraving ultrafine structures, and scientists are now also investigating how to use them to etch microstructures into thin glass. There are possible applications in analytics (lab on a chip) and especially in electronics and the consumer sector, where great interest has been shown.

This new method was born of a surprising phenomenon: irradiating glass in a particular way with an ultrafast laser has the effect of making the glass up to a...

Im Focus: Light-driven atomic rotations excite magnetic waves

Terahertz excitation of selected crystal vibrations leads to an effective magnetic field that drives coherent spin motion

Controlling functional properties by light is one of the grand goals in modern condensed matter physics and materials science. A new study now demonstrates how...

Im Focus: New 3-D wiring technique brings scalable quantum computers closer to reality

Researchers from the Institute for Quantum Computing (IQC) at the University of Waterloo led the development of a new extensible wiring technique capable of controlling superconducting quantum bits, representing a significant step towards to the realization of a scalable quantum computer.

"The quantum socket is a wiring method that uses three-dimensional wires based on spring-loaded pins to address individual qubits," said Jeremy Béjanin, a PhD...

Im Focus: Scientists develop a semiconductor nanocomposite material that moves in response to light

In a paper in Scientific Reports, a research team at Worcester Polytechnic Institute describes a novel light-activated phenomenon that could become the basis for applications as diverse as microscopic robotic grippers and more efficient solar cells.

A research team at Worcester Polytechnic Institute (WPI) has developed a revolutionary, light-activated semiconductor nanocomposite material that can be used...

Im Focus: Diamonds aren't forever: Sandia, Harvard team create first quantum computer bridge

By forcefully embedding two silicon atoms in a diamond matrix, Sandia researchers have demonstrated for the first time on a single chip all the components needed to create a quantum bridge to link quantum computers together.

"People have already built small quantum computers," says Sandia researcher Ryan Camacho. "Maybe the first useful one won't be a single giant quantum computer...

All Focus news of the innovation-report >>>



Event News

#IC2S2: When Social Science meets Computer Science - GESIS will host the IC2S2 conference 2017

14.10.2016 | Event News

Agricultural Trade Developments and Potentials in Central Asia and the South Caucasus

14.10.2016 | Event News

World Health Summit – Day Three: A Call to Action

12.10.2016 | Event News

Latest News

Greater Range and Longer Lifetime

26.10.2016 | Power and Electrical Engineering

VDI presents International Bionic Award of the Schauenburg Foundation

26.10.2016 | Awards Funding

3-D-printed magnets

26.10.2016 | Power and Electrical Engineering

More VideoLinks >>>