This international exhibition for glass products, manufacturing, processing, construction materials and applications opens its doors from June 13 – 16, 2012.
Siemens will be present in Pavilion 1, booth D23, with a range of solutions from batch preparation through glass manufacture and further processing to finished glass machining.
A key trade fair for the Eastern European region, this year the Mir Stekla will feature an array of innovations from Siemens Industry including solutions for sub-processes and integral automation solutions for the overall manufacturing sequence – from the raw material through to the finished end product.
The portfolio on offer to the glass industry is based on Totally Integrated Automation (TIA) and Totally Integrated Power (TIP), and ranges right across the spectrum from automation and drive technology through power supply and distribution systems to IT integration using coordinated MES (Manufacturing Execution Systems) components.
Another focus of the Siemens trade fair offering will be solutions to enhance energy efficiency in the glass industry. These encompass concepts designed to optimize the energy consumption of production facilities and also solutions for the recovery of industrial waste heat.
With its range of solutions, Siemens sets out to help its customers to save energy, make the most efficient use of resources and respond with the greatest possible flexibility to market needs. Mir Stekla offers companies the opportunity to showcase their products for the manufacture, processing and finishing of glass and glass products.
The exhibition draws trade visitors from all over Russia and the CIS (Commonwealth of Independent States).
Siemens Glass Manufacturing
| Siemens Presseservice
Creating living spaces for people: The »Fraunhofer CityLaboratory« at BAU 2017
14.10.2016 | Fraunhofer-Gesellschaft
Reducing Weight through Laser-assisted Material Processing in Automobile Construction
13.10.2016 | Fraunhofer-Institut für Lasertechnik ILT
Ultrafast lasers have introduced new possibilities in engraving ultrafine structures, and scientists are now also investigating how to use them to etch microstructures into thin glass. There are possible applications in analytics (lab on a chip) and especially in electronics and the consumer sector, where great interest has been shown.
This new method was born of a surprising phenomenon: irradiating glass in a particular way with an ultrafast laser has the effect of making the glass up to a...
Terahertz excitation of selected crystal vibrations leads to an effective magnetic field that drives coherent spin motion
Controlling functional properties by light is one of the grand goals in modern condensed matter physics and materials science. A new study now demonstrates how...
Researchers from the Institute for Quantum Computing (IQC) at the University of Waterloo led the development of a new extensible wiring technique capable of controlling superconducting quantum bits, representing a significant step towards to the realization of a scalable quantum computer.
"The quantum socket is a wiring method that uses three-dimensional wires based on spring-loaded pins to address individual qubits," said Jeremy Béjanin, a PhD...
In a paper in Scientific Reports, a research team at Worcester Polytechnic Institute describes a novel light-activated phenomenon that could become the basis for applications as diverse as microscopic robotic grippers and more efficient solar cells.
A research team at Worcester Polytechnic Institute (WPI) has developed a revolutionary, light-activated semiconductor nanocomposite material that can be used...
By forcefully embedding two silicon atoms in a diamond matrix, Sandia researchers have demonstrated for the first time on a single chip all the components needed to create a quantum bridge to link quantum computers together.
"People have already built small quantum computers," says Sandia researcher Ryan Camacho. "Maybe the first useful one won't be a single giant quantum computer...
14.10.2016 | Event News
14.10.2016 | Event News
12.10.2016 | Event News
26.10.2016 | Awards Funding
26.10.2016 | Power and Electrical Engineering
26.10.2016 | Health and Medicine