Forum for Science, Industry and Business

Sponsored by:     3M 
Search our Site:


DuPont presents a broad portfolio of material solutions at Wire 2008

The breadth and depth of material and technological solutions available from DuPont for the wire and cable industry will be on display at Wire 2008 in Düsseldorf, Germany, 31 March - 4 April 2008.

The company’s exhibit at stand G62 in Hall 11 will centre on its range of industrial polymers for improved performance in wire and cable compounds; the insulating capabilities of its fluoropolymer resins under the harshest environmental conditions; and its portfolio of speciality thermoplastics for extruded, high-performance insulation and/or jacketing applications. A presentation of the impregnating resins, wire enamels and core sheet varnishes developed by DuPont Electrical Insulation Systems rounds off the DuPont show exhibit.

Photo: DuPont
DuPont will exhibit a comprehensive portfolio of high performance materials and new technologies for the wire and cable industry at Wire 2008.

DuPont modifiers for improved wire and cable compound performance

DuPont™ Fusabond® coupling agents enable compounders to improve both mechanical properties and flame retardancy by allowing increased filler levels in halogen-free, flame retardant and low-smoke insulation and jacketing compounds. Making its debut at Wire 2008, Fusabond® NMO525D enhances compound flexibility by around 50 percent versus standard coupling agents, while maintaining high tensile strength and elongation at break. DuPont will also use the show to promote the use of Elvaloy® ethylene based terpolymers in halogen-free, flame-retardant cables to provide improved oil and chemical resistance and low temperature flexibility.

DuPont fluoropolymers for electrical insulation

Innovations in fluoropolymers, to be presented at Wire 2008, include new products and technologies for low-loss DuPont Teflon® PTFE and FEP wire constructions. A new foam grade, Teflon® FEP TE 9810, produces smaller, better dispersed and more homogenous voids, compared to previous Teflon® foam grades, for enhanced electrical properties in wires with melt extruded fluoropolymer insulations. Depending on the construction, this grade, Teflon® FEP TE 9810, has the ability to be self skinning, offering production of cost-effective, high-performance foam insulation for data cables. Meanwhile a new, licensable extrusion technology from DuPont incorporates air into the extruded Teflon® PTFE insulation for higher performance, low-loss data cables.

High performance extrusion solutions for wire and cable

As part of the DuPont exhibit for Wire 2008, DuPont Engineering Polymers will present a number of extrudable, speciality materials for the wire and cable industry, including DuPont™ Zytel® nylon resins, DuPont™ Crastin® PBT thermoplastic polyester resins and DuPont™ Hytrel® thermoplastic polyester elastomer resins and DuPont™ ETPV engineering thermoplastic vulcanizate. They are used in the development of finished products for either insulation and/or jacketing applications, as well as for straight or coiled cables with enhanced elastic memory recovery over a wide temperature range, which meet stringent requirements at an attractive final cost. End-use industries include automotive, transportation, robotics, appliance, shipyard, oil and alternative energies, to name a few.

DuPont is a science-based products and services company. Founded in 1802, DuPont puts science to work by creating sustainable solutions essential to a better, safer, healthier life for people everywhere. Operating in more than 70 countries, DuPont offers a wide range of innovative products and services for markets including agriculture and food; building and construction; communications; and transportation.

The DuPont Oval, DuPont™, The miracles of science™, Fusabond®, Elvaloy®, Teflon®, Zytel®, Crastin® and Hytrel® are registered trademarks or trademarks of E.I. du Pont de Nemours and Company or its affiliates.

Horst Ulrich Reimer | Du Pont
Further information:

More articles from Trade Fair News:

nachricht Creating living spaces for people: The »Fraunhofer CityLaboratory« at BAU 2017
14.10.2016 | Fraunhofer-Gesellschaft

nachricht Reducing Weight through Laser-assisted Material Processing in Automobile Construction
13.10.2016 | Fraunhofer-Institut für Lasertechnik ILT

All articles from Trade Fair News >>>

The most recent press releases about innovation >>>

Die letzten 5 Focus-News des innovations-reports im Überblick:

Im Focus: Etching Microstructures with Lasers

Ultrafast lasers have introduced new possibilities in engraving ultrafine structures, and scientists are now also investigating how to use them to etch microstructures into thin glass. There are possible applications in analytics (lab on a chip) and especially in electronics and the consumer sector, where great interest has been shown.

This new method was born of a surprising phenomenon: irradiating glass in a particular way with an ultrafast laser has the effect of making the glass up to a...

Im Focus: Light-driven atomic rotations excite magnetic waves

Terahertz excitation of selected crystal vibrations leads to an effective magnetic field that drives coherent spin motion

Controlling functional properties by light is one of the grand goals in modern condensed matter physics and materials science. A new study now demonstrates how...

Im Focus: New 3-D wiring technique brings scalable quantum computers closer to reality

Researchers from the Institute for Quantum Computing (IQC) at the University of Waterloo led the development of a new extensible wiring technique capable of controlling superconducting quantum bits, representing a significant step towards to the realization of a scalable quantum computer.

"The quantum socket is a wiring method that uses three-dimensional wires based on spring-loaded pins to address individual qubits," said Jeremy Béjanin, a PhD...

Im Focus: Scientists develop a semiconductor nanocomposite material that moves in response to light

In a paper in Scientific Reports, a research team at Worcester Polytechnic Institute describes a novel light-activated phenomenon that could become the basis for applications as diverse as microscopic robotic grippers and more efficient solar cells.

A research team at Worcester Polytechnic Institute (WPI) has developed a revolutionary, light-activated semiconductor nanocomposite material that can be used...

Im Focus: Diamonds aren't forever: Sandia, Harvard team create first quantum computer bridge

By forcefully embedding two silicon atoms in a diamond matrix, Sandia researchers have demonstrated for the first time on a single chip all the components needed to create a quantum bridge to link quantum computers together.

"People have already built small quantum computers," says Sandia researcher Ryan Camacho. "Maybe the first useful one won't be a single giant quantum computer...

All Focus news of the innovation-report >>>



Event News

#IC2S2: When Social Science meets Computer Science - GESIS will host the IC2S2 conference 2017

14.10.2016 | Event News

Agricultural Trade Developments and Potentials in Central Asia and the South Caucasus

14.10.2016 | Event News

World Health Summit – Day Three: A Call to Action

12.10.2016 | Event News

Latest News

How nanoscience will improve our health and lives in the coming years

27.10.2016 | Materials Sciences

OU-led team discovers rare, newborn tri-star system using ALMA

27.10.2016 | Physics and Astronomy

'Neighbor maps' reveal the genome's 3-D shape

27.10.2016 | Life Sciences

More VideoLinks >>>