Forum for Science, Industry and Business

Sponsored by:     3M 
Search our Site:


GEPPIA puts French processing/packaging expertise in spotlight at INTERPACK 2011

GEPPIA, the French Partnership for Processing & Packaging Equipment Manufacturers, will be taking part in the INTERPACK trade show in Düsseldorf (Germany) from 12 to 15 May 2011.

GEPPIA’s objective is to highlight new products as well as industrial and commercial services from 30 French equipment manufacturers that will be exhibiting at the trade show, and to provide comprehensive solutions for the international market.

At INTERPACK 2011, in Düsseldorf (Germany), between 12 and 15 May of this year, GEPPIA (Hall 6, Booth D10-D13) will showcase innovative products and services from about 30 of its members, who are all French equipment manufacturers specialised in packing and packaging.

Examples of new products to be showcased at INTERPACK 2011 include VersaFilm®, which has been developed by CERMEX (SIDEL GROUP) and constitutes a new range of shrink-wrappers without sealing bars. The SERAC GROUP will present its Roll ‘n Blow thermoforming machine for the production of bottles out of a basic plastic sheet. Another highlight will be SLEEVER INTERNATIONAL’s preview of its new machine concept, which can generate savings of up to 35% on clients’ expenditure.

GEPPIA will support about 30 French companies at the INTERPACK trade show. The companies expected to attend are: APEX Automate, ARCIL (Aprium, Synerwave, Synerlink), BERNHARDT et Cie - CDA LABELING, CERMEX (Groupe Sidel), CETEC Industrie SA, CLARANOR - CLEXTRAL SA, Ets André ZALKIN & Cie, FARBAL Production, HEMA (Groupe Sidel), IXAPACK, KARLVILLE Development SAS, LUCEO c/o Edixia (Groupe TIAMA), MECAPACK SA (Groupe Proplast), NEWTEC, OTOR (Groupe DS Smith), PAKEA - PKB, REVTECH, SERAC Group (Nova), SG2C, SLEEVER International, STERIFLOW Barriquand SAS, STOPPIL SA, TECHNIBAG,TECMA Pack, THIMONNIER.A, and TIFLEX SA.

GEPPIA members’ new products have been gathered into a booklet, which has been designed specifically for the trade show. This document, which gives details about each exhibitor, is available for download here:

GEPPIA’s objective is to support and promote equipment manufacturers belonging to the association, whilst highlighting their expertise. It does this by using the inherent synergies that characterise its member companies. After five years of existence, GEPPIA has already attracted almost 100 members and partners.
GEPPIA groups together almost all French equipment manufacturers that specialise in the design and manufacture of packing machines and automated packaging lines, as well as manufacturers of related machines and equipment.
GEPPIA will take part in the INTERPACK trade show, which will take place in Düsseldorf (Germany) from 12 to 15 May 2011 (Hall 6, Booth D10-D13).
For further information, please go to:

For further information, please contact :
Quote ref. : FTPB3564
Ms Mary-Ann WILLIAMS - Press Officer
UBIFRANCE Press Office in London
Tel: +44 (0) 207 024 3640

Mary-Ann Williams | UBIFRANCE
Further information:

Further reports about: French GEPPIA INTERPACK Roll ‘n Blow thermoforming machine

More articles from Trade Fair News:

nachricht Creating living spaces for people: The »Fraunhofer CityLaboratory« at BAU 2017
14.10.2016 | Fraunhofer-Gesellschaft

nachricht Reducing Weight through Laser-assisted Material Processing in Automobile Construction
13.10.2016 | Fraunhofer-Institut für Lasertechnik ILT

All articles from Trade Fair News >>>

The most recent press releases about innovation >>>

Die letzten 5 Focus-News des innovations-reports im Überblick:

Im Focus: Etching Microstructures with Lasers

Ultrafast lasers have introduced new possibilities in engraving ultrafine structures, and scientists are now also investigating how to use them to etch microstructures into thin glass. There are possible applications in analytics (lab on a chip) and especially in electronics and the consumer sector, where great interest has been shown.

This new method was born of a surprising phenomenon: irradiating glass in a particular way with an ultrafast laser has the effect of making the glass up to a...

Im Focus: Light-driven atomic rotations excite magnetic waves

Terahertz excitation of selected crystal vibrations leads to an effective magnetic field that drives coherent spin motion

Controlling functional properties by light is one of the grand goals in modern condensed matter physics and materials science. A new study now demonstrates how...

Im Focus: New 3-D wiring technique brings scalable quantum computers closer to reality

Researchers from the Institute for Quantum Computing (IQC) at the University of Waterloo led the development of a new extensible wiring technique capable of controlling superconducting quantum bits, representing a significant step towards to the realization of a scalable quantum computer.

"The quantum socket is a wiring method that uses three-dimensional wires based on spring-loaded pins to address individual qubits," said Jeremy Béjanin, a PhD...

Im Focus: Scientists develop a semiconductor nanocomposite material that moves in response to light

In a paper in Scientific Reports, a research team at Worcester Polytechnic Institute describes a novel light-activated phenomenon that could become the basis for applications as diverse as microscopic robotic grippers and more efficient solar cells.

A research team at Worcester Polytechnic Institute (WPI) has developed a revolutionary, light-activated semiconductor nanocomposite material that can be used...

Im Focus: Diamonds aren't forever: Sandia, Harvard team create first quantum computer bridge

By forcefully embedding two silicon atoms in a diamond matrix, Sandia researchers have demonstrated for the first time on a single chip all the components needed to create a quantum bridge to link quantum computers together.

"People have already built small quantum computers," says Sandia researcher Ryan Camacho. "Maybe the first useful one won't be a single giant quantum computer...

All Focus news of the innovation-report >>>



Event News

#IC2S2: When Social Science meets Computer Science - GESIS will host the IC2S2 conference 2017

14.10.2016 | Event News

Agricultural Trade Developments and Potentials in Central Asia and the South Caucasus

14.10.2016 | Event News

World Health Summit – Day Three: A Call to Action

12.10.2016 | Event News

Latest News

Greater Range and Longer Lifetime

26.10.2016 | Power and Electrical Engineering

VDI presents International Bionic Award of the Schauenburg Foundation

26.10.2016 | Awards Funding

3-D-printed magnets

26.10.2016 | Power and Electrical Engineering

More VideoLinks >>>