Forum for Science, Industry and Business

Sponsored by:     3M 
Search our Site:


Flexible electronics off the roll – more than just luminous film


Fraunhofer FEP works on cost-effective system solutions for flexible devices and presents results at Plastic Electronics 2014

A significant growth is predicted for the market of flexible devices. The topic “Wearables”, namely intelligent, wearable systems with several useful and funny features is currently one of the major discussion topics. To enjoy more comfort, exceptional designs and higher functionality manufacturers and users ask for flexible electronic devices, like displays, lighting elements or circuit boards.

Contacted OLED on thin glass

Although research and development groups have already made considerable progress in this field, not all challenges could be solved so far. Various topics are subject to further development, e.g. materials, processes, machines as well as system integration.

Fraunhofer FEP provides a roll-to-roll process line which enables the application of organic materials for OLED (organic light-emitting diodes), OPD (organic photodiodes) or OPV (organic photovoltaic) on flexible substrates in one complete technology. The process includes the structuring, automatic inspection of the initial substrates, the vapor deposition of the organics and, finally, the encapsulation of the coated films or glasses.

Organic electronics certainly require flexible electrical contacts. Therefore, Fraunhofer FEP implemented an additional printing process of metal contacts for the reliable contacting of, for example, large-area flexible OLED on metal, polymer and thin glass substrates. In cooperation with printing paste manufacturers and other suppliers, e.g. machine manufacturers, adhesive manufacturers, encapsulation film suppliers, the scientists are now able to develop optimized products for required process steps under production conditions.

Dr. Jacqueline Brückner, Project Manager Surface Analysis for the roll-to-roll organic technology, says: “Our customers have different requirements to design and mechanical stability of devices. With our know-how and our process equipment we provide a unique development platform for all these demands.”
For example, there are various solutions for the device contacting. Currently, several contacting solutions with flat ribbon cable, like ACF (Anisotropic Conductive Film)-Bonding, ACA (Anisotropically Conductive Adhesive)-Bonding or ACP (Anisotropic Conductive Paste)-Bonding are evaluated.
Examples of different contacting solutions, special contacting and encapsulation layouts for the roll-to-roll OLED processes will be presented at the booth at Plastic Electronics 2014.

Beside this exhibition, Dr. Olaf Hild of Fraunhofer FEP will give a talk with the topic “Organic Electronics and Organic Photodiodes“ at Tech Arena 1, ALPEXPO on October 7th, 12:40 pm.

About Fraunhofer FEP:
Fraunhofer Institute for Electron Beam, Plasma Technology and COMEDD FEP works on innovative solutions in the fields of vacuum coating, surface treatment and processing with electrons and plasmas as well as organic semiconductors. The core competences electron-beam technology, sputtering and plasma-activated as well as PECVD high-rate coating, technologies for the organic electronic and IC/system design provide the basis for these activities.

Thus Fraunhofer FEP offers a wide range of possibilities for research, development and pilot fabrication, especially for the processing, sterilization, structuring and refining of surfaces as well as OLED microdisplays, organic and inorganic sensors, optical filters and flexible OLED lighting.

Our aim is to develop the innovation potential of the electron beam, plasma technology and organic electronic for new production processes and devices and to make it available for our customers.

Visit us at booth no. 1032! (joint booth of Saxony)

Press contact:
Annett Arnold
Fraunhofer Institute for Electron Beam, Plasma Technology and COMEDD (FEP) | Phone +49 351 2586 452 |
Winterbergstraße 28 | 01277 Dresden | Gemany |

Weitere Informationen:

Annett Arnold | Fraunhofer-Institut

More articles from Trade Fair News:

nachricht Creating living spaces for people: The »Fraunhofer CityLaboratory« at BAU 2017
14.10.2016 | Fraunhofer-Gesellschaft

nachricht Reducing Weight through Laser-assisted Material Processing in Automobile Construction
13.10.2016 | Fraunhofer-Institut für Lasertechnik ILT

All articles from Trade Fair News >>>

The most recent press releases about innovation >>>

Die letzten 5 Focus-News des innovations-reports im Überblick:

Im Focus: New 3-D wiring technique brings scalable quantum computers closer to reality

Researchers from the Institute for Quantum Computing (IQC) at the University of Waterloo led the development of a new extensible wiring technique capable of controlling superconducting quantum bits, representing a significant step towards to the realization of a scalable quantum computer.

"The quantum socket is a wiring method that uses three-dimensional wires based on spring-loaded pins to address individual qubits," said Jeremy Béjanin, a PhD...

Im Focus: Scientists develop a semiconductor nanocomposite material that moves in response to light

In a paper in Scientific Reports, a research team at Worcester Polytechnic Institute describes a novel light-activated phenomenon that could become the basis for applications as diverse as microscopic robotic grippers and more efficient solar cells.

A research team at Worcester Polytechnic Institute (WPI) has developed a revolutionary, light-activated semiconductor nanocomposite material that can be used...

Im Focus: Diamonds aren't forever: Sandia, Harvard team create first quantum computer bridge

By forcefully embedding two silicon atoms in a diamond matrix, Sandia researchers have demonstrated for the first time on a single chip all the components needed to create a quantum bridge to link quantum computers together.

"People have already built small quantum computers," says Sandia researcher Ryan Camacho. "Maybe the first useful one won't be a single giant quantum computer...

Im Focus: New Products - Highlights of COMPAMED 2016

COMPAMED has become the leading international marketplace for suppliers of medical manufacturing. The trade fair, which takes place every November and is co-located to MEDICA in Dusseldorf, has been steadily growing over the past years and shows that medical technology remains a rapidly growing market.

In 2016, the joint pavilion by the IVAM Microtechnology Network, the Product Market “High-tech for Medical Devices”, will be located in Hall 8a again and will...

Im Focus: Ultra-thin ferroelectric material for next-generation electronics

'Ferroelectric' materials can switch between different states of electrical polarization in response to an external electric field. This flexibility means they show promise for many applications, for example in electronic devices and computer memory. Current ferroelectric materials are highly valued for their thermal and chemical stability and rapid electro-mechanical responses, but creating a material that is scalable down to the tiny sizes needed for technologies like silicon-based semiconductors (Si-based CMOS) has proven challenging.

Now, Hiroshi Funakubo and co-workers at the Tokyo Institute of Technology, in collaboration with researchers across Japan, have conducted experiments to...

All Focus news of the innovation-report >>>



Event News

#IC2S2: When Social Science meets Computer Science - GESIS will host the IC2S2 conference 2017

14.10.2016 | Event News

Agricultural Trade Developments and Potentials in Central Asia and the South Caucasus

14.10.2016 | Event News

World Health Summit – Day Three: A Call to Action

12.10.2016 | Event News

Latest News

Resolving the mystery of preeclampsia

21.10.2016 | Health and Medicine

Stanford researchers create new special-purpose computer that may someday save us billions

21.10.2016 | Information Technology

From ancient fossils to future cars

21.10.2016 | Materials Sciences

More VideoLinks >>>