<strong>Background</strong><br> The pre-patterning of a surface to obtain locally arranged nanostructures is usually done by complex patterning techniques like electron beam lithography, focused ion beam etching or ion implantation. These direct surface patterning techniques can cause crystal damage and defects degrading the quality and performance of the nanostructured elements. Other disadvantages are that these techniques only have short-range impact and are incompatible with batch processing.<br><br> <strong>Technology</strong><br> A method for fabricating layer assemblies with locally arranged nano-structures. A buried, selectively modified underlying layer is used to control the growth of nanostructures on the surface by controlling the laterally inhomogeneous strain distribution. This is done using standard lithography, etching and oxidation techniques. <br> <br> <strong>Benefits</strong><br> <ul> <li>Long-range impact</li> <li>No defects in close vicinity to the nanostructures</li> <li>Use of conventional structuring methods</li> <li>Electrical adressing of single nanostructures</li> <li>Create nanostructures even on unstructured surfaces</li> <li>Compatible to existing devices</li> </ul><br> <strong>IP Rights</strong><br> US Patent will be granted (priority 03/2011)<br> PCT application <br> <br> <strong>Origin</strong><br> Technische Universität Berlin, Germany</p>
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