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21.04.2010
The invention concerns a microwave antenna for semiconductor modules manufactured in flip-chip technology with two semiconductor substrates metalized on their surface. The construction according to the invention enables the manufacture of semiconductor modules, for example, for close-range radar systems and other sensors, micro-module labels and all kinds of chip cards and similar systems.

The microwave antenna enables the implementation of laterally directed radiating antennas with the help of wellestablished planar construction techniques. The technology facilitates the construction of miniaturized integrated beam transmitters. It is especially suitable for the frequency range between 10 and 150 GHz. Only a small amount of space on the outer surface of the module must be set aside for an antenna. In combination with one or more patch antennas, the microwave antenna according to the invention advantageously enables all-around radiation to be achieved in all spatial directions.

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PVA Mecklenburg-Vorpommern AG
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Moritz v. Grotthuss, Dr. Rüdiger Werp

info@technologieallianz.de | TechnologieAllianz e.V.
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http://www.technologieallianz.de/angebote.php?sort=sag&id=2017&lang=en
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