Metal pieces can be joined together by melting a metal or an alloy with a lower melting temperature than the metal pieces. Since 2006 the use of lead in electrical and electronic products is prohibited in the European Union. Therefore lead-free soldering pastes with low melting points are required. Nanoparticles have been proposed for the use in solder pastes as they have lower melting points than their bulk counterparts.<br><br> <strong>Technology</strong><br> According to legal requirements and the trend to use nanoparticle scientists at the Technische Universität Berlin now developed a method to obtain compact sintered silver layers as joining materials at low temperatures without applying pressure. Therefore a metal-organic silver complex is used that can generate silver nanoparticles during heat treatment below 200 °C. The complex offers the features to form a molten metal-like silver phase in which silver particles in the nanometer and submicron size range, respectively, are completely miscible. The connecting silver layer is stable up to a temperature of ~ 961°C, what is the melting point of bulk silver. In contrast to current state of the art soldering paste this one contains nearly no organic ingredients, as they mostly lead to holes or bubbles with in the bonding layer. First experiments were carried out with copper specimens and achieved pressureless copper-to-copper silver joints at low temperatures. <br><br>
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Permanent magnets are very important for technologies of the future like electromobility and renewable energy, and rare earth elements (REE) are necessary for their manufacture. The Fraunhofer Institute for Mechanics of Materials IWM in Freiburg, Germany, has now succeeded in identifying promising approaches and materials for new permanent magnets through use of an in-house simulation process based on high-throughput screening (HTS). The team was able to improve magnetic properties this way and at the same time replaced REE with elements that are less expensive and readily available. The results were published in the online technical journal “Scientific Reports”.
The starting point for IWM researchers Wolfgang Körner, Georg Krugel, and Christian Elsässer was a neodymium-iron-nitrogen compound based on a type of...
In the Beyond EUV project, the Fraunhofer Institutes for Laser Technology ILT in Aachen and for Applied Optics and Precision Engineering IOF in Jena are developing key technologies for the manufacture of a new generation of microchips using EUV radiation at a wavelength of 6.7 nm. The resulting structures are barely thicker than single atoms, and they make it possible to produce extremely integrated circuits for such items as wearables or mind-controlled prosthetic limbs.
In 1965 Gordon Moore formulated the law that came to be named after him, which states that the complexity of integrated circuits doubles every one to two...
Characterization of high-quality material reveals important details relevant to next generation nanoelectronic devices
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When current comes in discrete packages: Viennese scientists unravel the quantum properties of the carbon material graphene
In 2010 the Nobel Prize in physics was awarded for the discovery of the exceptional material graphene, which consists of a single layer of carbon atoms...
The trend-forward world of display technology relies on innovative materials and novel approaches to steadily advance the visual experience, for example through higher pixel densities, better contrast, larger formats or user-friendler design. Fraunhofer ISC’s newly developed materials for optics and electronics now broaden the application potential of next generation displays. Learn about lower cost-effective wet-chemical printing procedures and the new materials at the Fraunhofer ISC booth # 1021 in North Hall D during the SID International Symposium on Information Display held from 22 to 27 May 2016 at San Francisco’s Moscone Center.
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