Etching solution for matt etching of silicon substrates
In the semiconductor industry the surfaces of silicon substrates are roughened in order to maximise the bonding of the additional layers required and the bonding of the layers to each other. In the solar industry the surfaces are matted to increase the efficiency of the process or reduce the reflection of Si wafers. The new method for matt etching silicon substrates is characterised by the fact that a water-binding agent and a buffer containing fluoride ions are added to a mineral acid mixture consisting of highly concentrated acids.
Further Information: PDF
ESA Patentverwertungsagentur Sachsen-Anhalt GmbH
Phone: +49 (0)391/8 10 72 20
Contact
Dr. Stefan Schünemann
Media Contact
All latest news from the category: Technology Offerings
Newest articles
Bringing bio-inspired robots to life
Nebraska researcher Eric Markvicka gets NSF CAREER Award to pursue manufacture of novel materials for soft robotics and stretchable electronics. Engineers are increasingly eager to develop robots that mimic the…
Bella moths use poison to attract mates
Scientists are closer to finding out how. Pyrrolizidine alkaloids are as bitter and toxic as they are hard to pronounce. They’re produced by several different types of plants and are…
AI tool creates ‘synthetic’ images of cells
…for enhanced microscopy analysis. Observing individual cells through microscopes can reveal a range of important cell biological phenomena that frequently play a role in human diseases, but the process of…
