The five-axis, computer-controlled milling center can now perform two jobs: Three-dimensional deposition welding using a 1.5-kilowatt diode laser and component finishing using 5-axis milling.
The IWS’s manufacturing experts will be exhibiting their two-in-one machining solution on the joint Fraunhofer stand at the EUROMOLD trade show in Frankfurt from December 3 to 6, 2008 (Hall 8, Stand L113).
»We linked all the processing steps on the basis of uniform CAD and NC data, and implemented them in a single machine with one tool fixture,« relates Dr.-Ing. Steffen Nowotny of the IWS in Dresden. The 5-axis CNC milling center is ideal for performing repairs on mold inserts used to manufacture plastic components, and for machining finely structured surfaces and functional coatings on metallic components.
Instead of having to discard damaged precision tools, they can now be returned to the workshop, reprocessed by the laser welding and milling machine, and reused – thus saving costs and reducing expenditure on new tools.
The combination of laser cladding and milling is also a cost-effective method of manufacturing complex molds and metallic components directly from the 3-D CAD model. The machining system’s high degree of automation and its multitasking capability are extremely useful attributes in applications such as aircraft engine maintenance and automobile construction: »The software links together all the individual processes. This simplifies and speeds up the task of programming the machine,« says Nowotny.
The use of a complete machining solution significantly improves process efficiency, because the numerical control system regards the laser tool head and the milling spindle as interchangeable tools. The ability to switch rapidly and easily between milling and laser welding provides added flexibility, resulting in a machine that offers all the necessary features for time-saving manufacturing processes.
Dr.-Ing. Steffen Nowotny | alfa
Applying electron beams to 3-D objects
23.09.2016 | Fraunhofer-Institut für Organische Elektronik, Elektronenstrahl- und Plasmatechnik FEP
New process for cell transfection in high-throughput screening
21.03.2016 | Laser Zentrum Hannover e.V.
Researchers from the Institute for Quantum Computing (IQC) at the University of Waterloo led the development of a new extensible wiring technique capable of controlling superconducting quantum bits, representing a significant step towards to the realization of a scalable quantum computer.
"The quantum socket is a wiring method that uses three-dimensional wires based on spring-loaded pins to address individual qubits," said Jeremy Béjanin, a PhD...
In a paper in Scientific Reports, a research team at Worcester Polytechnic Institute describes a novel light-activated phenomenon that could become the basis for applications as diverse as microscopic robotic grippers and more efficient solar cells.
A research team at Worcester Polytechnic Institute (WPI) has developed a revolutionary, light-activated semiconductor nanocomposite material that can be used...
By forcefully embedding two silicon atoms in a diamond matrix, Sandia researchers have demonstrated for the first time on a single chip all the components needed to create a quantum bridge to link quantum computers together.
"People have already built small quantum computers," says Sandia researcher Ryan Camacho. "Maybe the first useful one won't be a single giant quantum computer...
COMPAMED has become the leading international marketplace for suppliers of medical manufacturing. The trade fair, which takes place every November and is co-located to MEDICA in Dusseldorf, has been steadily growing over the past years and shows that medical technology remains a rapidly growing market.
In 2016, the joint pavilion by the IVAM Microtechnology Network, the Product Market “High-tech for Medical Devices”, will be located in Hall 8a again and will...
'Ferroelectric' materials can switch between different states of electrical polarization in response to an external electric field. This flexibility means they show promise for many applications, for example in electronic devices and computer memory. Current ferroelectric materials are highly valued for their thermal and chemical stability and rapid electro-mechanical responses, but creating a material that is scalable down to the tiny sizes needed for technologies like silicon-based semiconductors (Si-based CMOS) has proven challenging.
Now, Hiroshi Funakubo and co-workers at the Tokyo Institute of Technology, in collaboration with researchers across Japan, have conducted experiments to...
14.10.2016 | Event News
14.10.2016 | Event News
12.10.2016 | Event News
21.10.2016 | Health and Medicine
21.10.2016 | Information Technology
21.10.2016 | Materials Sciences