Highly productive vacuum coating process of Fraunhofer FEP
For instance, in order to build a permeation barrier usually a layer stack is used, where a relatively thick, elastic smoothening layer is embedded in between the actual functional layers. So far, hitherto existing PECVD processes have not been feasible enough for the deposition of these interlayers due to their low coating rates. As alternatives lacquering processes have been used, which however require the transfer out off and back into the vacuum chamber. With the arcPECVD process a tool is now available, which is predestined for these applications and which can be applied in-line with other PVD processes.
The process, which is carried out at the low pressure of 0.1 … 5 Pa, can be effortlessly combined in a coating system with other PVD processes such as magnetron sputtering or electron beam deposition. This makes it possible to apply entire layer stacks in-line in only one vacuum run in roll-to-roll systems: this results in enormous savings in terms of time and money. The arcPECVD process was developed at the Fraunhofer FEP using the institute’s very own plasma sources and demonstrates good process stability. During a coating time of more than 2.5 hours, a constantly high coating rate of 2000 nm ∙ m/min ± 1.5 % could be achieved.
Annett Arnold | Fraunhofer-Institut
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