Forum for Science, Industry and Business

Sponsored by:     3M 
Search our Site:

 

IMEC reduces cost of double patterning lithography

15.07.2008
IMEC, in collaboration with JSR Corporation, realized a simplified process using only one etch step to reduce the cost of double patterning.

32nm lines and spaces were printed with a double exposure/single etch process, effectively freezing the resist after the first exposure. This simplified process paves the way for an industrial take-up of double patterning for the 32nm technology node.

Double patterning will be the primary lithography candidate for the 32nm technology node. But when using two litho and two etch steps, this technique will be expensive and slow. Therefore, IMEC is developing alternative process flows that reduce the cost-of-ownership by eliminating the intermediate etch step and replacing it with a process step in the litho track.

One way to eliminate the extra etch step is through freezing the resist after the first exposure. With this technique, IMEC has demonstrated 32nm node logic patterning. The freezing material used to reach this result has been developed by JSR Corporation. It prevents the resist from expanding (i.e. CD growth) or shrinking. And when the second resist layer is added, the two do not interact. Also, the freezing material is compatible with the lithography hardware.

The step of freezing the resist is done in the litho track. After exposing the first pattern, the resist is coated with the freezing material. Next, the wafer is baked to freeze the resist. Then the excess freezing material is removed using a developer. In the following step, a second resist layer is added and the second exposure is done. To prevent the second resist layer solvent from washing away the first resist, the freezing material changes the properties of the first resist layer so that it becomes non-soluble in the second resist layer.

This technique allowed printing 32nm dense lines using dipole illumination at 1.0NA. CDU for the 44nm HP lines was excellent (3s = 2.4nm). Moreover, 32nm node 2D logic cells as well as 32nm dense lines could be etched into poly. Lines resulting from the first and second lithography step cannot be distinguished, illustrating the good resolution obtained with this technique.

IMEC is currently transferring this process to its newly installed 1.35 NA immersion scanner (ASML XT:1900i) to explore this solution for sub-32nm half pitches (towards 22nm node).

Katrien Marent | alfa
Further information:
http://www.imec.be
http://www.imec.be/wwwinter/mediacenter/en/doublepattSemWest.shtml

More articles from Physics and Astronomy:

nachricht From rocks in Colorado, evidence of a 'chaotic solar system'
23.02.2017 | University of Wisconsin-Madison

nachricht Prediction: More gas-giants will be found orbiting Sun-like stars
22.02.2017 | Carnegie Institution for Science

All articles from Physics and Astronomy >>>

The most recent press releases about innovation >>>

Die letzten 5 Focus-News des innovations-reports im Überblick:

Im Focus: Safe glide at total engine failure with ELA-inside

On January 15, 2009, Chesley B. Sullenberger was celebrated world-wide: after the two engines had failed due to bird strike, he and his flight crew succeeded after a glide flight with an Airbus A320 in ditching on the Hudson River. All 155 people on board were saved.

On January 15, 2009, Chesley B. Sullenberger was celebrated world-wide: after the two engines had failed due to bird strike, he and his flight crew succeeded...

Im Focus: Breakthrough with a chain of gold atoms

In the field of nanoscience, an international team of physicists with participants from Konstanz has achieved a breakthrough in understanding heat transport

In the field of nanoscience, an international team of physicists with participants from Konstanz has achieved a breakthrough in understanding heat transport

Im Focus: DNA repair: a new letter in the cell alphabet

Results reveal how discoveries may be hidden in scientific “blind spots”

Cells need to repair damaged DNA in our genes to prevent the development of cancer and other diseases. Our cells therefore activate and send “repair-proteins”...

Im Focus: Dresdner scientists print tomorrow’s world

The Fraunhofer IWS Dresden and Technische Universität Dresden inaugurated their jointly operated Center for Additive Manufacturing Dresden (AMCD) with a festive ceremony on February 7, 2017. Scientists from various disciplines perform research on materials, additive manufacturing processes and innovative technologies, which build up components in a layer by layer process. This technology opens up new horizons for component design and combinations of functions. For example during fabrication, electrical conductors and sensors are already able to be additively manufactured into components. They provide information about stress conditions of a product during operation.

The 3D-printing technology, or additive manufacturing as it is often called, has long made the step out of scientific research laboratories into industrial...

Im Focus: Mimicking nature's cellular architectures via 3-D printing

Research offers new level of control over the structure of 3-D printed materials

Nature does amazing things with limited design materials. Grass, for example, can support its own weight, resist strong wind loads, and recover after being...

All Focus news of the innovation-report >>>

Anzeige

Anzeige

Event News

Booth and panel discussion – The Lindau Nobel Laureate Meetings at the AAAS 2017 Annual Meeting

13.02.2017 | Event News

Complex Loading versus Hidden Reserves

10.02.2017 | Event News

International Conference on Crystal Growth in Freiburg

09.02.2017 | Event News

 
Latest News

New pop-up strategy inspired by cuts, not folds

27.02.2017 | Materials Sciences

Sandia uses confined nanoparticles to improve hydrogen storage materials performance

27.02.2017 | Interdisciplinary Research

Decoding the genome's cryptic language

27.02.2017 | Life Sciences

VideoLinks
B2B-VideoLinks
More VideoLinks >>>