Increased summer precipitation apparently helping to spread spores of pathogen
Biologists studying a lethal blight of lodgepole pines in northwestern British Columbia present strong evidence in the September issue of BioScience that climate change is to blame for the outbreak. The blight, caused by the fungus Dothistroma septosporum, causes trees to lose their needles and, in the case of the British Columbia outbreak, eventually die. D. septosporum has long been recognized as a pathogen of pines, but although it is considered a serious disease of exotic plantations in the Southern Hemisphere, it has until now been considered a minor threat to northern temperate forests. Lodgepole pines are an economically important species, being used in construction and for pulp.
Alex Woods and his colleagues at the British Columbia Forest Service and the University of Alberta investigated climate records in the area of the outbreak. The records provided no evidence of warming in the affected area in recent years, but they did reveal a clear increase in summer precipitation over the past decade. That constituted a smoking gun, because D. septosporums life cycle depends on summer moisture for spore distribution. The increase in precipitation had no clear link to a known climatic oscillation that might have explained it, and the authors conclude that it is most likely related to a directional climate trend. The report of Woods et al. appears to represent one of a growing number of examples of an indirect effect of climate change, because increased summer precipitation would have been expected, absent D. septosporum, to benefit lodgepole pines.
Donna Royston | EurekAlert!
Novel mechanisms of action discovered for the skin cancer medication Imiquimod
21.10.2016 | Technische Universität München
Second research flight into zero gravity
21.10.2016 | Universität Zürich
Researchers from the Institute for Quantum Computing (IQC) at the University of Waterloo led the development of a new extensible wiring technique capable of controlling superconducting quantum bits, representing a significant step towards to the realization of a scalable quantum computer.
"The quantum socket is a wiring method that uses three-dimensional wires based on spring-loaded pins to address individual qubits," said Jeremy Béjanin, a PhD...
In a paper in Scientific Reports, a research team at Worcester Polytechnic Institute describes a novel light-activated phenomenon that could become the basis for applications as diverse as microscopic robotic grippers and more efficient solar cells.
A research team at Worcester Polytechnic Institute (WPI) has developed a revolutionary, light-activated semiconductor nanocomposite material that can be used...
By forcefully embedding two silicon atoms in a diamond matrix, Sandia researchers have demonstrated for the first time on a single chip all the components needed to create a quantum bridge to link quantum computers together.
"People have already built small quantum computers," says Sandia researcher Ryan Camacho. "Maybe the first useful one won't be a single giant quantum computer...
COMPAMED has become the leading international marketplace for suppliers of medical manufacturing. The trade fair, which takes place every November and is co-located to MEDICA in Dusseldorf, has been steadily growing over the past years and shows that medical technology remains a rapidly growing market.
In 2016, the joint pavilion by the IVAM Microtechnology Network, the Product Market “High-tech for Medical Devices”, will be located in Hall 8a again and will...
'Ferroelectric' materials can switch between different states of electrical polarization in response to an external electric field. This flexibility means they show promise for many applications, for example in electronic devices and computer memory. Current ferroelectric materials are highly valued for their thermal and chemical stability and rapid electro-mechanical responses, but creating a material that is scalable down to the tiny sizes needed for technologies like silicon-based semiconductors (Si-based CMOS) has proven challenging.
Now, Hiroshi Funakubo and co-workers at the Tokyo Institute of Technology, in collaboration with researchers across Japan, have conducted experiments to...
14.10.2016 | Event News
14.10.2016 | Event News
12.10.2016 | Event News
21.10.2016 | Health and Medicine
21.10.2016 | Information Technology
21.10.2016 | Materials Sciences