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Engineering Information's Compendex Database Adds 10 Millionth Record

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03.08.2007

Today, Engineering Information announced the 10 millionth record has been added to the Compendex database and loaded on the Engineering Village discovery platform. Compendex is the definitive bibliographic database covering published engineering literature, which is used by professional engineers, engineering students, researchers and information professionals worldwide.

Since its creation in 1969, Compendex has offered the broadest coverage of significant engineering literature available. Over the past 38 years, the database has expanded its coverage steadily as the volume of published engineering literature has grown. In 2006 alone, over 650,000 new records were added to the Compendex database. Records are carefully selected and indexed to ensure a breadth of literature upon which researchers can rely. Compendex now covers over 5,600 serial sources each year, originating from more than 55 countries.

The 10 millionth article added to Compendex on the Engineering Village discovery platform is titled “Hydrothermal synthesis of hydroxyapatite powders using alkyl ammonium bromides as surfactants.” The article is authored by a team of researchers led by Hyun-Jung Park from the Department of Ceramics Building Materials at the Korea Institute of Ceramic Engineering and Technology and appears in the journal Key Engineering Materials, volume 342-343, 2007.

“We are extremely proud that the Compendex database continues to keep pace with the ever-growing body of published literature in engineering,” explains Ross Graber, Engineering Information’s Director of Marketing. “Even as Compendex reaches the 10 million record milestone, its records continue to be selected and indexed to provide engineering students and professionals with an invaluable tool for their research. Compendex is now more widely used and trusted as a comprehensive source of quality, engineering-specific literature than ever.”

Leah Snyder | Source: alphagalileo
Further information: www.ei.org
www.elsevier.com/

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