“We’ve developed a new process and equipment that will lead to a significant reduction in heat generated by silicon chips or microprocessors while speeding up the rate at which information is sent,” says Rajendra Singh, D. Houser Banks Professor and director for the Center for Silicon Nanoelectronics at Clemson University.
The heart of many high-tech devices is the microprocessor that performs the logic functions. These devices produce heat depending on the speed at which the microprocessor operates. Higher speed microprocessors generate more heat than lower speed ones. Presently, dual-core or quad-core microprocessors are packaged as a single product in laptops so that heat is reduced without compromising overall speed of the computing system. The problem, according to Singh, is that writing software for these multicore processors, along with making them profitable, remains a challenge.
“Our new process and equipment improve the performance of the materials produced, resulting in less power lost through leakage. Based on our work, microprocessors can operate faster and cooler. In the future it will be possible to use a smaller number of microprocessors in a single chip since we’ve increased the speed of the individual microprocessors. At the same time, we’ve reduced power loss six-fold to a level never seen before. Heat loss and, therefore, lost power has been a major obstacle in the past,” said Singh.
Participants in the research included Aarthi Venkateshan, Kelvin F. Poole, James Harriss, Herman Senter, Robert Teague of Clemson and J. Narayan of North Carolina State University at Raleigh. Results were published in Electronics Letters, Oct. 11, 2007, Volume: 43, Issue: 21, pages: 1130-1131. The work reported here is covered by a broad-base patent of Singh and Poole issued to Clemson University in 2003.
The researchers say the patented technique has the potential to improve the performance and lower the cost of next-generation computer chips and a number of semiconductor devices, which include green energy conversion devices such as solar cells.
“The potential of this new process and equipment is the low cost of manufacturing, along with better performance, reliability and yield,” Singh said. “The semiconductor industry is currently debating whether to change from smaller (300 mm wafer) manufacturing tools to larger ones that provide more chips (450 mm). Cost is the barrier to change right now. This invention potentially will enable a reduction of many processing steps and will result in a reduction in overall costs.”
South Carolina has a growing semiconductor related industry, and the developers of this new process and equipment say it provides the potential for creating new jobs in the allied semiconductor equipment manufacturing industry.
Rajendra Singh | EurekAlert!
Powerful IT security for the car of the future – research alliance develops new approaches
25.05.2018 | Universität Ulm
Supercomputing the emergence of material behavior
18.05.2018 | University of Texas at Austin, Texas Advanced Computing Center
The more electronics steer, accelerate and brake cars, the more important it is to protect them against cyber-attacks. That is why 15 partners from industry and academia will work together over the next three years on new approaches to IT security in self-driving cars. The joint project goes by the name Security For Connected, Autonomous Cars (SecForCARs) and has funding of €7.2 million from the German Federal Ministry of Education and Research. Infineon is leading the project.
Vehicles already offer diverse communication interfaces and more and more automated functions, such as distance and lane-keeping assist systems. At the same...
A research team led by physicists at the Technical University of Munich (TUM) has developed molecular nanoswitches that can be toggled between two structurally different states using an applied voltage. They can serve as the basis for a pioneering class of devices that could replace silicon-based components with organic molecules.
The development of new electronic technologies drives the incessant reduction of functional component sizes. In the context of an international collaborative...
At the LASYS 2018, from June 5th to 7th, the Laser Zentrum Hannover e.V. (LZH) will be showcasing processes for the laser material processing of tomorrow in hall 4 at stand 4E75. With blown bomb shells the LZH will present first results of a research project on civil security.
At this year's LASYS, the LZH will exhibit light-based processes such as cutting, welding, ablation and structuring as well as additive manufacturing for...
There are videos on the internet that can make one marvel at technology. For example, a smartphone is casually bent around the arm or a thin-film display is rolled in all directions and with almost every diameter. From the user's point of view, this looks fantastic. From a professional point of view, however, the question arises: Is that already possible?
At Display Week 2018, scientists from the Fraunhofer Institute for Applied Polymer Research IAP will be demonstrating today’s technological possibilities and...
So-called quantum many-body scars allow quantum systems to stay out of equilibrium much longer, explaining experiment | Study published in Nature Physics
Recently, researchers from Harvard and MIT succeeded in trapping a record 53 atoms and individually controlling their quantum state, realizing what is called a...
25.05.2018 | Event News
02.05.2018 | Event News
13.04.2018 | Event News
25.05.2018 | Event News
25.05.2018 | Machine Engineering
25.05.2018 | Life Sciences