The technology will be ready for production in the second half of 2008 or earlier and will, among other things, utilize low-K inter-metal dielectric and the 193-nm patterning process. The smaller geometries will allow for smaller die sizes and faster transistors, bringing a better price-performance profile to Silterra’s customers. A team of Silterra and IMEC engineers will fine-tune the base-IMEC process at IMEC’s research facility in Leuven to meet the specifications defined by Silterra. The process will have physical design rules and electrical characteristics that match mainstream technologies, enabling customers to seamlessly support their multi-foundry sourcing strategy.
“Silterra is committed to the pure foundry business and more advanced process technology development is essential to support the success of our customers. Many of our major customers adopted the multi-foundry strategy and we will continue to grow with them. This project paves the way towards future technology nodes and a migration path to 300mm,” said Kah-Yee Eg, CEO of Silterra. “As proven in our earlier engagement with IMEC, this JDP will enable Silterra to bring a new process into production quickly.”
“We are very pleased that we will continue the successful collaboration with Silterra to develop a foundry process that will benefit such a wide customer base,” stated Prof. Gilbert Declerck, president and CEO of IMEC. “Our 90-nm platform technology is a great starting point to build on because it is proven and will help shorten development cycle times significantly.”
The new process, like Silterra’s own foundry compatible 0.13- and 0.18-micron logic technologies, is targeted for a wide range of products for consumer, communications and computational applications. In addition, the technology is also optimized for CPU, DSP and graphics applications. This jointly developed foundry process opens the door for Silterra to collaborate with other foundry players in rapidly bringing advanced node densities to production.
“We see significant business growth in the next 2-3 years and will continue to actively invest in process technology,” said Eg. “We had built up strong in-house capabilities in developing process technologies for specific applications such as RF, High Voltage and Low Power in 0.18-micron for the past few years and we are currently developing these application specific process technologies on 0.13-micron. We will continue to move these technologies down to 90-nm and 65-nm with our customers. Our aim is to offer the best total solution to our customers – and the availability of technologies for the right process node is critical to that goal.”
Fraunhofer FIT joins Facebook's Telecom Infra Project
25.10.2016 | Fraunhofer-Institut für Angewandte Informationstechnik FIT
Stanford researchers create new special-purpose computer that may someday save us billions
21.10.2016 | Stanford University
Ultrafast lasers have introduced new possibilities in engraving ultrafine structures, and scientists are now also investigating how to use them to etch microstructures into thin glass. There are possible applications in analytics (lab on a chip) and especially in electronics and the consumer sector, where great interest has been shown.
This new method was born of a surprising phenomenon: irradiating glass in a particular way with an ultrafast laser has the effect of making the glass up to a...
Terahertz excitation of selected crystal vibrations leads to an effective magnetic field that drives coherent spin motion
Controlling functional properties by light is one of the grand goals in modern condensed matter physics and materials science. A new study now demonstrates how...
Researchers from the Institute for Quantum Computing (IQC) at the University of Waterloo led the development of a new extensible wiring technique capable of controlling superconducting quantum bits, representing a significant step towards to the realization of a scalable quantum computer.
"The quantum socket is a wiring method that uses three-dimensional wires based on spring-loaded pins to address individual qubits," said Jeremy Béjanin, a PhD...
In a paper in Scientific Reports, a research team at Worcester Polytechnic Institute describes a novel light-activated phenomenon that could become the basis for applications as diverse as microscopic robotic grippers and more efficient solar cells.
A research team at Worcester Polytechnic Institute (WPI) has developed a revolutionary, light-activated semiconductor nanocomposite material that can be used...
By forcefully embedding two silicon atoms in a diamond matrix, Sandia researchers have demonstrated for the first time on a single chip all the components needed to create a quantum bridge to link quantum computers together.
"People have already built small quantum computers," says Sandia researcher Ryan Camacho. "Maybe the first useful one won't be a single giant quantum computer...
14.10.2016 | Event News
14.10.2016 | Event News
12.10.2016 | Event News
25.10.2016 | Earth Sciences
25.10.2016 | Power and Electrical Engineering
25.10.2016 | Process Engineering