Forum for Science, Industry and Business

Sponsored by:     3M 
Search our Site:

 

EraSME: The first transnational project is starting now

24.10.2006
The first transnational co-operation project of the European initiative EraSME is starting now.

EraSME is a co-operation between more than 20 European funding agencies running or at least planning SME-oriented programmes. The aim of the project is to foster international co-operation between SMEs and RTOs (research or technology organisations) or universities. Transnational joint projects are supported concertedly by several countries; the money comes from the various national support programmes. Each country brings its own support programme into the common pilot project.

EraSME launched a Consortia Pilot Joint Call for project proposals some months ago. Nine projects out of 25 were preselected for funding. AppSN (Application Enablers for Rapidly Developed Sensor Networks) was the first project to start. The project will be funded by the Swedish and the German government and supervised by the agencies VINNOVA (Swedish Governmental Agency for Innovation Systems) and VDI/VDE-IT (VDI/VDE Innovation + Technik GmbH). Germany participates in EraSME with the InnoNet programme of the Federal Ministry of Economics and Technology. The swedish partner VINNOVA is participating with the AIS programme.

The project partners will develop tools for designing, testing and managing wireless sensor networks on the basis of technologies and components (ScatterNodes). These tools will be tested in several pilot applications in different areas. The consortium consists of the coordinator SICS (Swedish Institute of Computer Science), the FU Berlin (Freie Universität Berlin) and the companies Scatterweb (D), Electronic Guard Center (S), EightCut (S), Communication Research Labs Sweden (S) and Ericsson (S).

After the Consortia Pilot Joint Call, the EraSME project launched a second call named Food for Better Human Health. Ten proposals had been submitted by the September 15 deadline. Parallel to the evaluation of these proposals, a third Call of the EraSME project is in preparation. The deadline of the call will probably be February 15. More information will be published in a pre-announcement at the beginning of November.

EraSME is the first test of transnational support which takes into account the specific innovation systems of the different countries.

Wiebke Ehret | alfa
Further information:
http://www.vdivde-it.de
http://www.era-sme.net

More articles from Information Technology:

nachricht Deep Learning predicts hematopoietic stem cell development
21.02.2017 | Helmholtz Zentrum München - Deutsches Forschungszentrum für Gesundheit und Umwelt

nachricht Sensors embedded in sports equipment could provide real-time analytics to your smartphone
16.02.2017 | University of Illinois College of Engineering

All articles from Information Technology >>>

The most recent press releases about innovation >>>

Die letzten 5 Focus-News des innovations-reports im Überblick:

Im Focus: Breakthrough with a chain of gold atoms

In the field of nanoscience, an international team of physicists with participants from Konstanz has achieved a breakthrough in understanding heat transport

In the field of nanoscience, an international team of physicists with participants from Konstanz has achieved a breakthrough in understanding heat transport

Im Focus: DNA repair: a new letter in the cell alphabet

Results reveal how discoveries may be hidden in scientific “blind spots”

Cells need to repair damaged DNA in our genes to prevent the development of cancer and other diseases. Our cells therefore activate and send “repair-proteins”...

Im Focus: Dresdner scientists print tomorrow’s world

The Fraunhofer IWS Dresden and Technische Universität Dresden inaugurated their jointly operated Center for Additive Manufacturing Dresden (AMCD) with a festive ceremony on February 7, 2017. Scientists from various disciplines perform research on materials, additive manufacturing processes and innovative technologies, which build up components in a layer by layer process. This technology opens up new horizons for component design and combinations of functions. For example during fabrication, electrical conductors and sensors are already able to be additively manufactured into components. They provide information about stress conditions of a product during operation.

The 3D-printing technology, or additive manufacturing as it is often called, has long made the step out of scientific research laboratories into industrial...

Im Focus: Mimicking nature's cellular architectures via 3-D printing

Research offers new level of control over the structure of 3-D printed materials

Nature does amazing things with limited design materials. Grass, for example, can support its own weight, resist strong wind loads, and recover after being...

Im Focus: Three Magnetic States for Each Hole

Nanometer-scale magnetic perforated grids could create new possibilities for computing. Together with international colleagues, scientists from the Helmholtz Zentrum Dresden-Rossendorf (HZDR) have shown how a cobalt grid can be reliably programmed at room temperature. In addition they discovered that for every hole ("antidot") three magnetic states can be configured. The results have been published in the journal "Scientific Reports".

Physicist Dr. Rantej Bali from the HZDR, together with scientists from Singapore and Australia, designed a special grid structure in a thin layer of cobalt in...

All Focus news of the innovation-report >>>

Anzeige

Anzeige

Event News

Booth and panel discussion – The Lindau Nobel Laureate Meetings at the AAAS 2017 Annual Meeting

13.02.2017 | Event News

Complex Loading versus Hidden Reserves

10.02.2017 | Event News

International Conference on Crystal Growth in Freiburg

09.02.2017 | Event News

 
Latest News

Stingless bees have their nests protected by soldiers

24.02.2017 | Life Sciences

New risk factors for anxiety disorders

24.02.2017 | Life Sciences

MWC 2017: 5G Capital Berlin

24.02.2017 | Trade Fair News

VideoLinks
B2B-VideoLinks
More VideoLinks >>>